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CA-180 conductive adhesive is for die-attach applications in smart cards, circuit assembly, photonics or camera modules. Is said to cure in 30 min. at 80°C or in seconds at 200°C. Glass transition temperature (Tg) and modulus are said to be moderate. Rheology optimized for needle dispensing by time-pressure, auger or positive displacement. Develops conductivity with short, low-temperature cures. After curing for 30 minutes at 80°C, its electrical conductivity is 0.00006 ohm-cm.

Engineered Materials Systems, www.emsadhesives.com.

 

 

 

 

CUBE.460 mini-wave selective soldering system comes in a batch platform and can be configured with a single or dual nozzle. Supports an easy-to-use exchangeable solder pot for dual alloys. Comes standard with heated nitrogen at the soldering nozzle, 0° and 7° soldering to accommodate various types of nozzles including wetted nozzle tips and non-wetted nozzles, live viewing camera, and Quartz IR bottom-side preheater.

Juki Automation Systems, www.jukiamericas.com

 

DataMan 8050 series has a ruggedized housing to handle harsh factory floor conditions. For high-speed barcode reading of labels, direct inkjet or laser-marked codes. Is based on 8500 platform. Utilizes patented 1DMax+ with Hotbars algorithms. Is said to read damaged, low contrast or direct inkjet barcodes, and decode a variety of 2-D symbologies, including DataMatrix, QR, PDF417 and Aztec codes. Come in corded and wireless communication modules. Use with USB, USB keyboard, RS-232 and Bluetooth.

Cognex, http://www.cognex.com

 

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