Products
Fineplacer pico ma is for bonding anisotropic conductive film (ACF). Achieves applied bonding forces of up to 700 N, for coherent, durable bonds between the chip and ACF. Features a new multi-chip transfer station, which permits up to four components to be placed simultaneously and bonded with defined distances. Precision z-hub positioning table achieves 5-micron placement accuracy. Places component sizes from 0.125 x 0.125mm to 40 x 40mm and the shifting optics enable alignment of long chip edges. Supports wafer or substrate sizes up to 8". Suited for high-mix, low-volume applications.
FineTech, www.finetechusa.com
TAGS: FineTech, ACF, anisotropic conductive film, component bonding
Loctite Multicore HF 212 halogen-free, Pb-free solder paste is under the limit of detection for chlorine and bromine. Reportedly has consistent print performance and minimal hot slump, even at temperatures that exceed 86°F and relative humidity as high as 80%. Exhibits low voiding in CSP via-in-pad joints, good coalescence, and solderability over a range of surface finishes, including NiAu, immersion Sn, CuNiZn, immersion Ag and OSP copper. For use on components with pitches of 0.3mm and greater; is ideal for larger boards used in industrial, networking and lighting applications.
Henkel, www.henkel.com/electronics
Loctite Multicore HF 212 halogen-free, Pb-free solder paste is under the limit of detection for chlorine and bromine. Reportedly has consistent print performance and minimal hot slump, even at temperatures that exceed 86°F and relative humidity as high as 80%. Exhibits low voiding in CSP via-in-pad joints, good coalescence, and solderability over a range of surface finishes, including NiAu, immersion Sn, CuNiZn, immersion Ag and OSP copper. For use on components with pitches of 0.3mm and greater; is ideal for larger boards used in industrial, networking and lighting applications.
Henkel, www.henkel.com/electronics
