Products
VT-X700 inline, automated 3D CT x-ray analyzes printed circuit boards, including those with hidden solder joints. Inspects solder quality on components from BGAs to chips, and through-hole devices. Inspections are performed at 5 sec. per field-of-view. Gauges PCB surface for each solder joint, compensating for warpage; performs cross-sectional analysis at slice-level locations. Has selectable resolutions of 10, 15, 20, 25 or 30µm combined with selectable numbers of x-ray projections (up to 128).
Omron, www.omron247.com/
VT-X700 inline, automated 3D CT x-ray analyzes printed circuit boards, including those with hidden solder joints. Inspects solder quality on components from BGAs to chips, and through-hole devices. Inspections are performed at 5 sec. per field-of-view. Gauges PCB surface for each solder joint, compensating for warpage; performs cross-sectional analysis at slice-level locations. Has selectable resolutions of 10, 15, 20, 25 or 30µm combined with selectable numbers of x-ray projections (up to 128).
Omron, www.omron247.com/
VT-S500 has 3D image processing; analyzes topographical features of solder fillets. Is capable of performing solder inspections that mimic IPC guidelines. Software is capable of absorbing production inconsistencies and noise. Provides high-speed inspections and has dual-lane availability. Is available with camera magnifications of 10 or 15µm; is capable of processing PCBs up to 510 x 610mm (single-lane applications) or 510 x 300mm (dual-lane applications).
Omron, www.omron247.com/
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