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Sarcon 30HR silicone-based thin film exhibits a 1.7 W/m°K thermal conductivity when placed between a heat source such as a semiconductor and heatsink. Eliminates air gaps between components. Increased surface contact can improve cooling performance of a heatsink. Has a thermal resistance of 0.42°Cin2/W and is recommended for applications with operational temperatures that range from -60° to +180°C. The V-0 flame-retardant thin film comes in roll widths up to 85mm.

Fujipoly America, www.fujiploy.com

Excen high-speed modular mounter has 16 nozzles and a speed of 120,000 CPH. Is for fine chip placement; monitors pre- and post-part placement. Has a side-view vision system. Includes non-stop device type change; mixed production of different boards, and a smart feeder with auto splicing and auto loading functions. Applies high rotary modular head.

Samsung Techwin SMT, http://www.samsung-smt.com

Alternative Tracks permits components to be installed in multiple tracks of the component cart. When the first feeder runs empty, the system automatically switches to an alternate, which can be set up on any track of the component cart. Designed for applications where splicing should be avoided or where traceability is needed at the component level. If a component reel runs out, the job can continue running non-stop with predefined alternative components. When a track is empty, the system automatically switches to a feeder and components on an alternative track. The respective feeders and components can be set up on the same component cart. Operators can set up alternative tracks in advance as part of the product setup or immediately before the primary track is about to run empty.

ASM Assembly Systems, www.siplace.com

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