Through-hole connection system kits come in 0.8mm, 1mm and 1.2mm sizes. Involve a simple manual process for conductivisation of holes in circuit boards. Help achieve plated through-holes on PCBs without investing in an electroplating system. Ensure flat finish on both sides of the hole. Contain tooling and bails for 250 holes, one size per pack. Additional packs of 10 bail-bars are available. Operate by applying a conductive coating to the walls of a circuit board hole, while maintaining a flat surface on both sides. Holes are left with a solder-plated copper wall and a solder-filled barrel. If a through-hole is not required, top and bottom pads are soldered. Where a through-hole is necessary, the solder core is removed with a de-soldering tool or wick after soldering both sides. Holes are left with a tin-plated electrolytic-quality copper sleeve pressed into the hole walls. Bail-bars consist of lengths of solder wire, which have been electroplated with pure copper, then over-plated with tin and scored at intervals of approximately 2mm. Each bail-bar is divided into 25 bails. End of the bail-bar is inserted into the hole using an insertion tool; bail-bar is snapped off to leave one bail in the hole. An automatic snap punch is placed over the end of the bail and pressed down. Hole may be de-soldered if a clear through-hole is required. Components in kit: insertion tool; punch; 10 bail bars (250 holes); five appropriately sized drill bits, and anvil. 

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