Products
SI-F1000 series micro-head spectral-interference laser displacement sensor is designed to provide high-precision performance in a 2mm diameter sensor head. Is a low power optical system using fiber-optic detecting; measurements can be taken without electromagnetic effects or additional head to measurement system. External signal processing is eliminated. Controller models include built-in digital and analog data outputs. Includes onboard data storage and calculation functions. Applications include wafer thickness and warpage mapping; media thickness and surface characterization, and inline thickness measurement of transparent webs and coatings.
Keyence, www.keyence.com/PRSI
TMV (through mold via) 14mm board drop test Pb-free kit is designed for Amkor TMV component. Eight-layer test board is a 3x5 array with 15 component placements per board. Is 132 x 77mm and 1mm thick. Standard surface finish is OSP. Is designed for TMV 620 solder ball 0.4mm pitch bottom component and TMV 200 solder ball 0.5mm top component. Both have a daisy chain pattern through the substrate of the part; daisy chain pattern also runs through the test board.
Practical Components, www.practicalcomponents.com
Right-angle Q Rate 5mm body design connectors are for backplane and other high-speed applications with coplanar and perpendicular applications. Ground/power plane of QRM8-RA and QRF8-RA series permits contacts to be placed closer together without degrading signal performance. Equipped with ground/power plane and signal-integrity-optimized Edge Rate contacts. Surface of contacts increases wear life; minimizes effects of broadside coupling. Robust when mating and unmating; features a long contact wipe. 0.8mm pitch right-angle system is dual-row and available in 1, 2 or 3 banks, with up to 78 positions per row. Optional guideposts for blind mating are available. Also available in a vertical orientation with stack heights from 7 to 14mm.
Samtec, www.samtec.com
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