Products
Q-BI58 is Pb-free solid wire for heat-sensitive assemblies. Is composed of 42% tin and 58% bismuth wire solder. Is a soldering alternative for heat-sensitive components that require a low melting point. Meets or exceeds J-STD-006 requirements and all other relevant standards. Sn42/Bi58 is sold per 500 g. box, and is available in a wide variety of diameters.
Qualitek International Inc., www.qualitek.com
Ablestik WBC-8901UV is for stacked die packages for the memory market, including TSOPs, MCPs and FMCs. Reportedly reduces total cost of ownership up to 50% compared to film. Can adjust die attach thickness based on specific manufacturing requirements; can select dicing tape of choice. Is applied via a spray coating method following wafer thinning process. Dicing tape is laminated to the wafer; backgrinding tape is removed, and the wafer is diced in preparation for die pickup and placement. Wafer coating of 10 µm, with a total thickness variation across the wafer of +/-10%, and material waste of less than 20% are possible.
Henkel, www.henkelna.com
Tridak Model 795 pneumatic dispensing spool valve dispenses high-viscosity fluids, gels, and pastes that require high pressure to achieve suitable material flow. Is for silicone gels, greases, adhesives and sealants. Adjustable flow control ensures accurate and repeatable fluid dispense cycles; adjustable suck-back feature provides clean fluid shutoff. Is designed to operate with fluid pressures up to 2,000 psi.
Tridak, www.tridak.com
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