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Products

OvenChecker thermal profiler verifies that ovens remain in spec after a board’s initial “characterization” profile. Is designed to be self-contained, and requires no thermocouples or repeated use of golden boards. Reportedly can be taught to an operator in less than two minutes. Comes in a kit that includes a three-sensor pallet, V-M.O.L.E. thermal profiler with M.A.P. software, and a thermal barrier.

Is said to perform over 1,000 runs without degradation.

ECD, www.ecd.com/products/ovenchecker

 

 

RP-113178 Pick-and-Place Underfilm enhances CSP and BGA solder joint reliability. Air or nitrogen reflow compatible. Requires no prebaking of boards. Is reportedly 100% reworkable and RoHS-compatible. Is said to reduce solder joint fatigue failures, and requires no additional cure cycle. Implement into design and manufacturing process by utilizing existing SMT Line and existing tape and reel feeders. Comes in standard EIA-481 carrier tape.
 
Alltemated Inc., www.alltemated.com
 

 

Stacked Die Tool software performs acoustic imaging to identify anomalies and defects in stacked die configurations. Can image all of the interfaces in a stack of eight die. Can sort out the correct echoes and provide acoustic imaging accuracy.
 
Sonoscan, www.sonoscan.com

 

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