The Modular Compact platform consists of MC-12, MC-1 and MC-8. Packs up to 126 ultra-thin (12-mm) feeders into each machine. A side-view camera prevents placement defects. Has full-featured graphical programming tools and common family setups and production scheduling. Incorporates intelligent and lightweight feeders that reportedly can be changed in seconds. Includes offline preparation, online loading units and Feeder Exchange Systems. Standard equipped with tape cutting. MC-12 has vision recognition that uses a moving side-view scan camera with advanced optics; simultaneously takes X and Y component measurements; helps prevent misplaced or missing components, and rejects components with bent leads, damaged bumps or that have been picked upside down. A chipshooter places up to 36,000 cph with 50µm accuracy at 3 sigma. With up to 120 feeder positions, space productivity is 20,000 cph/m2. MC-1 multifunctional mounter (19,100 cph and 126 feeder positions) and MC-8 fine-pitch mounter (8,900 cph and 119 feeder positions) both have 30 µm accuracy. All have automatic nozzle cleaning procedures. Platform accepts component range from 0.4 x 0.2 mm up to 100 x 45 mm, or 55 x 55 mm with component heights up to 25.5 mm, and programmable placement forces from 10 to 30N for press-fitting complex components. Accepts boards up to 510 x 460 mm. On-board tools enable teaching of placement locations, fiducials and component shapes.
Assembléon, www.assembleon.com
MRS-1000 Modular Rework System is a benchtop solution comprised of a handheld convection tool with an array of nozzles, preheater, adjustable tool holder with board holder, and light magnifier. Is manually assisted and said to be ideal for removal of delicate SMT components and other processes requiring increased control. Standard features include programmability, a digital display, program storage of up to 50 profiles and adjustability.
OK International, www.okinternational.com
The MT2168 pick-and-place test handler is configurable and comes with up to 16 contact sites. Reported index time is 0.38 sec. and temperature accuracy is +/-1.0°C. Features soak capacity for 3.5 JEDEC trays and throughput of up to 20,000 uph. Handles BGAs, QFNs QFPs and other thin and small devices (3.0 x 3.0 x 0.3 mm) with contact pitches of 0.3 mm or higher.
Multitest Elektronische Systeme GmbH, www.multitest.com