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FlexSolder S3532 is for high-speed stamp soldering a controlled nitrogen atmosphere. Is said to provide advantages over typical multi-flow types; does not use any pumps, and is fast and clean, with no overspray. Top and bottom contour plates keep the PCB in place in X, Y and Z, and control board warpage caused by either previous double-sided reflow or the PCB characteristics. Requires minimal programming; no CAD, Gerber or other data needed.

Juki Corp., www.jas-smt.com

RED-E-SET board support reportedly can reduce component damage caused by misaligned bottom-side board support tooling or placement pressures. Is for screen printers, dispensers and automated assembly machines. Can reportedly be configured in fewer than three minutes. Is said to provide zero defects; eliminates board flex using a spring-loaded support pin system.

Production Solutions Inc., www.production-solutions.com

SE500 3-D solder paste inspection system inspects assemblies with a >70 cm2/sec. inspection speed. Can inspect pad sizes down to 01005. Has two models that accommodate different panel sizes. Features a conveyor that can transport panels from 50 x 50 mm up to 510 x 510 mm. SE500X can transport panels from 100 x 100 mm up to 810 x 610 mm. Features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and Process Tracker SPC charts with alarm capability.

CyberOptics Corp., www.cyberoptics.com

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