Desktop systems for hot bar bonding applications use pulsed heat technology; can be used for hot bar reflow soldering, ACF bonding, heat-seal bonding and heat staking. Provide a method for joining flexible circuits, edge connectors, ribbon cables and PCMCIA connectors to PCBs or substrates. Are a series of modular systems consisting of a pulsed heat power supply (Uniflow), a pneumatic bonding head and a quick connect block with thermo-plane thermode. Modules are mounted on an adjustable frame. Can be upgraded with a left-right slide, front-rear slide, and a manual or pneumatic 2-position index table. Available options include camera alignment modules, Kapton or Silicon interposer feeders, water-cooling and fume extraction.

Miyachi Unitek, www.muc.miyachi.com