The Grab-Eez wipe dispenser is said to be economical, dispensing only one wipe at a time. The double C-fold design gives each wipe an exposed edge so that the user can grab one wipe without touching the next. Said to conform to housekeeping practices and protects wipes from the environment until use.
Wedge emulation technology is for low profile interconnects, fine pitch, running stitch interconnects, and die-to-die bonding in high-density packages such as LEDs and RF packages. Uses Model 8000 ball bonder. Said to bond seven to 12 wires per second. Can program an interconnect beginning with a stitch instead of ball; complies with visual standards defined per Mil-Std-883, Method 2017. Can use a wire other than gold, such as aluminum or copper.
IPC-7351A LP Wizard is for the CR-5000 PCB and advanced packaging suite. This land pattern generator is said to reduce the time it takes to build a standard SMT footprint/symbol for a library part; ensures compatibility with the latest IPC standard for surface mount design. The task reportedly takes less than a minute. Consists of land pattern viewers, calculators and generators for the creation of CAD land patterns, including pads, padstacks and footprints/symbols in SMT parts libraries. Dovetails with free IPC library documentation and viewer provided with IPC-7351 standard. Data can be shared with engineers throughout organization on a project-by-project basis.