Products
Endicott Interconnect Technologies will exhibit semiconductor packaging solutions at Semicon West, July 10-14, at booth, #5484C in the NY Loves Nanotech pavilion.
Semiconductor packaging offerings include HyperBGA, CoreEZ and Wire Bond PBGA. EI will also showcase its PCB fabrication, first- and second-level assembly solutions.
HyperBGA is a flouropolymer-based, organic flip-chip package for high performance applications where speed, reliability and increased signal I/O, along with reduced weight and package size, are critical. This low stress flip-chip laminate package is suited to graphics applications that require high data processing speeds or any application requiring a system-in-package approach.
CoreEZ uses the HyperBGA manufacturing platform to offer organic, thin core build-up, flip chip technology that combines electrical, reliability and wireability performance with cost effective materials and processes. For applications requiring low-cost build-up materials with high performance, or for aerospace applications requiring radiation tolerance.
To expand the market place for CoreEZ, EI entered into a Memorandum of Understanding with Meadville Technologies Group to produce the organic substrates at their Shanghai Silicon Platform facility; qualification builds are currently underway.
Wire Bond PBGA offers electrical performance and material properties that are matched to the PCB, to deliver high performance and field reliability. The chip-up design is economical and targets lower power applications while the cavity package provides thermal performance.
Endicott Interconnect Technologies, www.endicottinterconnect.com
Semiconductor packaging offerings include HyperBGA, CoreEZ and Wire Bond PBGA. EI will also showcase its PCB fabrication, first- and second-level assembly solutions.
HyperBGA is a flouropolymer-based, organic flip-chip package for high performance applications where speed, reliability and increased signal I/O, along with reduced weight and package size, are critical. This low stress flip-chip laminate package is suited to graphics applications that require high data processing speeds or any application requiring a system-in-package approach.
CoreEZ uses the HyperBGA manufacturing platform to offer organic, thin core build-up, flip chip technology that combines electrical, reliability and wireability performance with cost effective materials and processes. For applications requiring low-cost build-up materials with high performance, or for aerospace applications requiring radiation tolerance.
To expand the market place for CoreEZ, EI entered into a Memorandum of Understanding with Meadville Technologies Group to produce the organic substrates at their Shanghai Silicon Platform facility; qualification builds are currently underway.
Wire Bond PBGA offers electrical performance and material properties that are matched to the PCB, to deliver high performance and field reliability. The chip-up design is economical and targets lower power applications while the cavity package provides thermal performance.
Endicott Interconnect Technologies, www.endicottinterconnect.com
Dage will exhibit two of its developments in x-ray inspection and bondtesting technology at Semicon West on July 10-13. On display will be the XiDAT XD7600NT digital x-ray inspection system with a new computerized tomography (CT) option, and the enhanced 4000HS high-speed bondtester.
The CT option further refines the system with volumetric measurement of solder joints. CT capability is available as an option with new systems and is suited for analysis of solder interconnections such as stacked die, MEMS, package-in-package and package-on-package.
The Bondtester is the result of considerable research as part of a U.S. consortium and detects brittle fracture failures in the ball-to-pad interconnection of Pb-free semiconductor devices. Its capabilities have been further enhanced with digital transducer signal processing, force versus displacement (FvD) curves and fractional energy calculation.
Dage Precision Industries, dageinc.com.
Semicon West Booth 7315
The CT option further refines the system with volumetric measurement of solder joints. CT capability is available as an option with new systems and is suited for analysis of solder interconnections such as stacked die, MEMS, package-in-package and package-on-package.
The Bondtester is the result of considerable research as part of a U.S. consortium and detects brittle fracture failures in the ball-to-pad interconnection of Pb-free semiconductor devices. Its capabilities have been further enhanced with digital transducer signal processing, force versus displacement (FvD) curves and fractional energy calculation.
Dage Precision Industries, dageinc.com.
Semicon West Booth 7315
Thermo Electron has developed a GC/MS solution capable of performing reliable, precise analysis of polybrominated diphenyl ethers (PBDEs). It combines the high-resolution double focusing magnetic sector (DFS) GC/MS system, the TRACE GC Ultra gas chromatograph and the TriPlus autosampler to enable high sample throughput at low detection limits. Developed for scientists monitoring organic toxic pollutants in governmental, commercial and industrial/contract laboratories to comply with RoHS and WEEE.
Low detection limits are important for the confirmation analysis of brominated flame retardants and persistent organic pollutants (POPs). PBDEs are widely used in a variety of different industrial products. Similar to dioxins/furans and PCBs (polychlorinated biphenyls), PBDEs exist in a high number of congeners, many of which have been banned by recent legislation.
DFS for target compound analysis uses isotope dilution for quantitation with highest precision and significance analyzing PBDEs, with ultimate selectivity providing limits of quantitation in the low femtogram range. Features improved transmission, an intuitive user interface and a compact footprint.
Featuring heating and cooling oven performance, the TRACE increases sample throughput and decreases run times without compromising analytical resolution, precision or reliability. Equipped with a split/splitless injector.
Merging robotic technology for vials and syringe operation with advanced controls of the three dimensional space movements of the syringe holder (XYZ), the autosampler provides flexibility and automation in sample capacity for high productivity.
Thermo Electron Corporation, thermo.com
Low detection limits are important for the confirmation analysis of brominated flame retardants and persistent organic pollutants (POPs). PBDEs are widely used in a variety of different industrial products. Similar to dioxins/furans and PCBs (polychlorinated biphenyls), PBDEs exist in a high number of congeners, many of which have been banned by recent legislation.
DFS for target compound analysis uses isotope dilution for quantitation with highest precision and significance analyzing PBDEs, with ultimate selectivity providing limits of quantitation in the low femtogram range. Features improved transmission, an intuitive user interface and a compact footprint.
Featuring heating and cooling oven performance, the TRACE increases sample throughput and decreases run times without compromising analytical resolution, precision or reliability. Equipped with a split/splitless injector.
Merging robotic technology for vials and syringe operation with advanced controls of the three dimensional space movements of the syringe holder (XYZ), the autosampler provides flexibility and automation in sample capacity for high productivity.
Thermo Electron Corporation, thermo.com
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