Products
Medalist 5DX automated x-ray inspection’s 8.4 software release reportedly contains specialized algorithms that permit inspection of quad-flat, no-lead (QFN) components with reduced false call rates; defect characterization on non-wetted direct FET (field-effect transistor) by using an open slope paste test; and a threshold enabling inspection for solder presence along side edges of capacitors.
Agilent Technologies, www.agilent.com
Agilent Technologies, www.agilent.com
The LNC 60 is used to simultaneously align components on six nozzles on each placement head inside JUKI’s newest pick-and-place machines. The LaserAlign sensor reportedly allows the component alignment process to perform rapidly on the fly. Will be used in KE-2070 series of high-speed chip shooters and KE-2080 series of high-speed flexible mounters, reportedly capable of placing down to 01005 components.
CyberOptics, www.cyberoptics.com
The BondJet BJ915 heavy wire bonder reportedly offers the highest speed and accuracy, and the largest work area available. Highlights are said to include a 10% speed increase over BJ910 with bonding speeds reported as fast as 450 ms/wire (300µm diameter 8 mm loop length wire) and 10 µm at 3 sigma placement accuracy. Said to be the only heavy wire bonder with both integrated pull test and nondestructive shear test capability. A process-integrated quality control (PIQC) system is said to provide wire deformation graphs for multiple or single wires, data logging of all error messages and tolerance limits, storage and printing of deformation curves for analysis, statistics, and process control.
Hesse & Knipps, www.hesse-knipps.com
Press Releases
- Kitron Secures EUR 37M order for Next-Generation Tactical Communication Equipment
- Scanfil Comparison Figures for Updated Customer Groups
- Javad EMS Invests in Inovaxe Smart Storage Carts to Streamline Material Management and Boost Production Efficiency
- ViTrox Announces Strategic Partnership with High Tech Solutions (HTS) to Strengthen Presence in Argentina