Products
DDf Ultra can feed a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.
Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
Performance is optimized to handle small flip chips. Is capable of feeding die down to 0.5 mm sq. at over 6,000 die/hr.
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state-of-the-art SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.”
Hover-Davis, hoverdavis.com
ETCO Mighty-T Press is a bench-top semi-automatic press and wire terminal applicator for low volume users that replaces hand crimping. Features a rigid one-piece cast iron frame, employs a 40 mm stroke with 4,450 lbs. of crimping force and includes a footswitch, safety interlock and reel arm. Wire terminal applicator has a two-piece anvil to crimp wire and insulation ear sections in a single stroke. Eliminates hand crimping and has an open architecture for easy feed adjustment and tooling changes.
Suited for up to 5,000 terminations/hr., depending upon the terminal and wire combination, accepts applicator feeds from the right, left or rear and has a 7.9 x 23 x 11.8” footprint. Accepts virtually all mini-style applicators with a standard “T” style coupling. Can handle wire up to 9 AWG, terminals from 0.006” though 0.32” thick and a variety of tooling.
ETCO Inc., etco.com
Suited for up to 5,000 terminations/hr., depending upon the terminal and wire combination, accepts applicator feeds from the right, left or rear and has a 7.9 x 23 x 11.8” footprint. Accepts virtually all mini-style applicators with a standard “T” style coupling. Can handle wire up to 9 AWG, terminals from 0.006” though 0.32” thick and a variety of tooling.
ETCO Inc., etco.com
Building on its portfolio of high-speed backplane connectors, Tyco has introduced the Z-PACK MAX connector as a cost-effective interconnect for backplane applications where high speed, high density and high performance are needed.
“In listening to our customers we heard the need for a cost effective high-speed product and quickly focused significant resources in responding to that need. The result of that effort is the Z-PACK MAX product line,” said Bob Hnatuck, high-speed backplane connector product manager. “One of our goals is to offer a portfolio of products which provides our customers with options and gives them the flexibility to meet their requirements. The Z-PACK MAX backplane connector system performs at speeds up to 10 Gbps and beyond for applications including servers, storage devices, switches, routers and similar high-speed signal applications.”
To achieve the 10+ Gbps speed, ground contacts are positioned within each connector column and are combined with lead frame arrangements within the connector to achieve low crosstalk and high throughput. Employs a shield-less design. Dual point contact mating and compliant pin board mounting help ensure reliability. Meet Telcordia requirements and are RoHS compliant.
Available in a five-pair version (with 26 pairs per 10 mm, or 66 differential pairs per in.), or a four-pair version (with 21 pairs per 10 mm, or 53 differential pairs per in.). Accommodate 25.40 mm (five pair) and 20.32mm (four pair) card slot spacing. Planned product extensions include a three-pair version for narrow card pitch applications, right angle pin headers for coplanar applications, vertical receptacles for mezzanine applications and high-speed cable assemblies.
Tyco Electronics, www.tycoelectronics.com
“In listening to our customers we heard the need for a cost effective high-speed product and quickly focused significant resources in responding to that need. The result of that effort is the Z-PACK MAX product line,” said Bob Hnatuck, high-speed backplane connector product manager. “One of our goals is to offer a portfolio of products which provides our customers with options and gives them the flexibility to meet their requirements. The Z-PACK MAX backplane connector system performs at speeds up to 10 Gbps and beyond for applications including servers, storage devices, switches, routers and similar high-speed signal applications.”
To achieve the 10+ Gbps speed, ground contacts are positioned within each connector column and are combined with lead frame arrangements within the connector to achieve low crosstalk and high throughput. Employs a shield-less design. Dual point contact mating and compliant pin board mounting help ensure reliability. Meet Telcordia requirements and are RoHS compliant.
Available in a five-pair version (with 26 pairs per 10 mm, or 66 differential pairs per in.), or a four-pair version (with 21 pairs per 10 mm, or 53 differential pairs per in.). Accommodate 25.40 mm (five pair) and 20.32mm (four pair) card slot spacing. Planned product extensions include a three-pair version for narrow card pitch applications, right angle pin headers for coplanar applications, vertical receptacles for mezzanine applications and high-speed cable assemblies.
Tyco Electronics, www.tycoelectronics.com
Press Releases
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