Master Bond EP21AC is a two-part epoxy with non-halogenated filler formulated for applications where arc resistance and flame retardancy are required.
X858x and X698x science cameras provide high-speed and high-res thermal imaging for scientific research and engineering applications, including PCB test and measurement, within mid-wave infrared and long-wave infrared spectrum.
Megatron 8 material for multilayer printed circuit boards is for high-speed communication networking equipment such as routers and switches.