DEK will launch the VectorGuard Nickel Laser Cut stencil range at ATExpo on Sept. 27-29. The event will include DEK’s high accuracy mass imaging solutions in booth 5400.
The stencils are designed to address the challenges presented by lead-free, accommodating the effects of changing paste rheology on aperture release characteristics. Said to deliver a high level of paste volume repeatability to optimize process yield and uniformity.
DEK representatives will provide lead-free advice to delegates wanting to learn more. Clive Ashmore, global applied process engineering group manager at DEK, will also be presenting a lead-free paper - Mass Imaging of Lead-Free Material.
Haverhill, MA – Ultrasonic Systems’ Optima Fluxing System has an Ultra-Spray head that produces a more vertical spray pattern, ensuring through-hole penetration on the wide, thick circuit boards.
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
FRANKLIN, MA – Speedline Technologies will showcase MPM printers, an Electrovert reflow oven and wave soldering equipment at ATExpo booth 5710.
Speedline’s exhibit at the show will spotlight the following:
MPM AccuFlex printing system will be part of the live, working electronics assembly line. The printer is for moderate volume, high-mix printing. Combines accuracy and flexibility in a compact footprint, the printer offers a range of options for future expansion or advanced processes. Designed for production of 8,000 boards/week, with two or more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is well positioned for the challenge of lead-free assembly and increasingly complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.