According to Christopher Associates, OEM requirements for improved manufacturing yields have led to strong demand for the Koh Young 3 dimensional solder paste inspection systems.
The KY 3030VAXL (24 x 27” panel size) high-speed 3-D solder paste inspection system was developed to inspect very high density, high technology telecommunications substrates for 100% volumetric and shape defects. Designed, manufactured and delivered within 10 weeks of receipt of order to a large EMS manufacturer.
Additional installations include a number of the KY 3030VAL (18 x 20” substrate) systems installed at a major EMS manufacturer; a major automotive electronics manufacturer has also ordered multiple systems. Among the advantages cited after extensive evaluations by each customer were ease of use, accuracy and speed.
Christopher Associates Inc., christopherweb.com
St. Louis -- HIGHLIGHTER multi-directional LED ring light uses a simple mouse to control the direction of the lights, as well as the intensity and number of LEDs illuminated. Works on all makes of microscopes, as well as the speckFINDER Video Microscope.
Inspection and quality control workers can view surface defects and overcome visibility problems. Hard-to-see imperfections in plastic and metal surfaces, defects in solder joints and details on translucent surfaces all become apparent when highlighted.
Users can direct up to 40 LEDS either clockwise or counter clockwise by rotating the mouse control. A left mouse click activates automatic continuous rotation of 1 to 39 LEDS so the operator can compare and contrast the image under different lighting, without having to move the object being viewed. A right click of the mouse alters light intensity to meet optical instrument and individual requirements. The dimmable ring light offers five settings from 100 to 2%.
The ergonomic mouse occupies minimal workspace and eliminates “big box” controls.
Davor Manufacturing Corp., dazor.com
1075-EXR 44 wave solder flux is developed specifically for Pb-free wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies.
Is water-based and non-flammable, eliminating special storage requirements and reducing VOC emissions. Said to provide excellent surface wetting, eliminate cleaning and reduce solder balling. Can also be used for Sn/Pb assemblies.
Indium Corp., www.indium.com