Circuits Assembly Online Magazine - Current Issue

Products

Milara Inc. will showcase its STW-1 wafer printing system in booth 9821 at the Semicon West show July 12-14, in San Francisco.

SemiTouch Wafer Printer system offers wafer stencil printing and bumping in a single system. By pressing a single button, the system converts itself from a wafer bumper to stencil printer in seconds.

Incorporates a vision system with accuracies of 12 µm that yields capabilities of ultra-fine-pitch printing. Uses patented vibration squeegee technology, employs the same technology to accomplish ultra-fine pitch-printing (down to 70 µm) with 100% printing reliability (no missed apertures on wafers with excess of 25,000 per print) in conjunction with solder brick geometry.

Capable of printing 300 mm wafers. Environmentally friendly, uses less paste than standard systems and has less waste build-up.

Milara Inc., milarasmt.com

SUN VALLEY, CA— Creative Automation Co. will highlight its automated dispensing system, Champion 6809, in booth 7531 at SEMICON West.

The servo-driven dispensing system, designed for precision processes, features proprietary software, a GUI for intuitive programming and control, and a large, bright, high-contrast color TFT display. Can be configured to match application requirements from dots to underfills with an array of options. Placement accuracy is within 3 mm.

Designed for nano dispensing, dispenses dot diameters down to 0.003" (75 mm) with bead width down to 0.003" (75 mm). Volumes are below 0.5 nanoliters (0.0000005 cc’s), and the pump is capable of firing up to 90,000 precision deposits per hour to form high-definition dots, lines, fills and builds. Volume repeatability is 1.7% at3 Sigma.Uses true positive displacement without augers and pump motors.

Comes standard with a three-axis brushless servo motor drive; x- and y-axis linear encoders, z-axis rotary encoding; powerful Windows-style software; LCD display; rugged construction and quiet operation; a small footprint; and a one-year warranty.

Creative Automation Co., creativedispensing.com

DES PLAINES, IL — Kester will highlight SE-CURE UT-10 TIM in booth 8802 at Semicon West.

The lead-free, SMT-compatible, high-performance thermal interface material consists of a paste containing both fusible and non-fusible metals in a 100%-solids, thermosetting polymer matrix. Can be dispensed or stencil-printed and is processable on standard lead-free SMT reflow profiles. Can be used for attachment of power die to lead frames or ceramic or organic substrates. The fusible alloy is Sn96.5Ag3.0Cu0.5.

Features an advanced three-component composite system that leverages polymer and metals technology. The material costs less than silver-filled adhesives.

Reportedly provides higher performance than Ag-filled adhesives at lower material and overall process costs. Controlled-collapse bond line ensures repeatable assembly characteristics and thermal performance. In applications where over-molding is performed, it eliminates problems associated with solder squirting. The polymer component is compatible with epoxy-based over-molding chemistry.

Kester, kester.com