Products
DEK 248 semi-automatic printers have a new PC-based user interface, allowing operators to view all machine parameters at a glance. A new keyboard features integrated trackball. Has integrated support for Simplified Chinese, Korean and Japanese. A 3.5-inch floppy disk drive is included.
Supports optional vision capabilities. Vision setup features are fully integrated, real-time image data is displayed on-screen. Vision information of the product is saved automatically with the product file.
The new UI resembles the interface available for DEK's high-end fully automatic platforms, enhancing commonality between machines in the range.
ALPHA OM-325 lead-free solder is said to simplify the transition to µ-fine feature printing in lead-free processes. Reportedly offers excellent print transfer efficiency, self-alignment properties with small components down to 0402 or 01005", joint cosmetics across challenging reflow profiles, low voiding performance and product stability.
"We developed ALPHA OM-325 in our Japanese R&D center in collaboration with leading global adaptors of lead-free technology for use in their high end consumer electronics products," said Valentijn Van Velthoven, global product manager. "Our rigorous product development work for OM-325 can be compared to what Formula One technology means for the automotive industry. We have achieved tomorrow's technology, and made it available today."
Made with Type 4 and 5 powder, the paste delivers excellent µ-fine feature print yield and works well in demanding high-soak reflow profiles.
PELASPAN-PAC Anti-Static provides cushioning for a range of electronic parts and components to protect them from static discharge during shipment. The pink, s-shaped polystyrene material is free-flowing, cutting packaging time. Weighs 5 pounds per cubic foot - 15% lighter than comparable varieties of packing peanuts. Reusable, recyclable and part of a nationwide reuse program to lessen the loose-fill sent to landfills each year.
Available from 20 facilities nationwide.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing