Products
Pyramax 98 solder reflow oven is now equipped with an integrated flux coating and wafer handling system for wafer bump reflow. The coating system can handle 200 or 300 mm wafers and is configured with an integrated robotic wafer handler.
At the oven's back-end, an automated unloading station completes the integrated wafer handling process.
Features forced impingement technology for temperature uniformity and an optional closed-loop convection control for constant heat transfer and cooling rates. Provides atmosphere purity below 5ppm and reportedly has the industry's lowest nitrogen consumption.
The user-friendly SlimKIC 2000 profiler and process development tool has been upgraded to accommodate new applications including rework, batch ovens, and high- temperature furnaces. The new applications are built directly into the standard software at no additional cost.
With the conversion to lead-free manufacturing and its narrow thermal process window, rework is more critical and requires better profiling tools. The new software, which claims to provide better control and documentation of the rework process, is on display at booth 5015 at the Assembly Technology Expo this week in Rosemont, IL.
AuL2220 stand-alone, fully automatic printer with auto unload eliminates substrate handling issues for high-volume, fine pitch production. May also eliminate the need for expensive bare-board and magazine loaders. Allows transport upstream automatically to the pick-and-place station. Can be unloaded manually.
Equipped with:
- auto vision alignment with over 10,000 individual program file storage.
- adjustable magnetic PCB support.
- programmable squeegee drive, pressure, stroke and speed.
- understencil wiper module (with vacuum).
- motorized or programmable conveyor width adjustment.
Has 20 x 23" print area; will accommodate both cast and welded tubular stencils.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing