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Productronica 2009 Products

Siplace SiCluster Professional software determines component overlaps in family setups. Groups shared components on constant component tables, which remain on the machine during setup changeovers. Reportedly reduce setup time by hours, while reducing space and investment requirements for feeders and component carts by up to 33%. Is available as an add-on to Siplace Pro v. 7.1, which offers setups for single products or product families combined with fixed setups, offline setups of feeder tables and changeover tables concepts, nonstop setup changeovers with line execution system, or random setups of individual feeder modules.

Siemens Electronics Assembly Systems, www.siplace.com

Multicore LF730 Pb-free solder paste uses DAP Plus Type 4 solder powder and a flux medium said to permit greater process latitude. Reportedly prints thorough apertures as small as 160 µm, permitting more solder per aperture with less risk of aperture clogging. Volume release is said to be over 90%.

Wets to a range of surface finishes, and can be used in environments from 30°C at 84% RH. Features open and abandon times of two to three hours, standard refrigeration storage, six-month shelf life and good hot slump resistance.

Henkel, www.henkel.com/electronics

Dual Lane Reflow Oven provides high- and low-volume SMT soldering in one reflow unit. Features flexible production in parallel and is compatible for both Pb-free and leaded SMT. Reportedly reduces floor space 47% compared to traditional dual-lane production lines. Contains two independent conveyor lanes and two heating areas. Has 18 independently programmable heating zones, with both top and bottom side heating areas. Conveyor speeds and widths are independently controlled and adjustable.

SEHO Systems GmbH, www.sehona.com