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Productronica 2009 Products

GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.

Seho Systems, www.sehona.com

S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.

S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.

Koki Co. Ltd., www.ko-ki.co.jp

M22X DL-18/460 Desktop AOI inspects SMT and PTH components (presence, type, polarity, offset, text, etc.) and reflow and wave solder joints (including meniscus). Provides 2-D solder paste inspection. Handles medium and large PCBs. Features high-speed digital XGA color camera, as well as analysis via synthetic imaging. Combines speed and accuracy of CL systems with a new lighting concept. Three pulse wave modulated LED light sources (main, side and DOAL) can lighten inspection points from three different angles. Up to six different lighting combinations are available.

Marantz, www.escapethegrayworld.com