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Productronica 2009 Products

Peelable Solder Mask (PSM-AF) is ammonia-free. Is noncorrosive, and for temporary solder/coating protection. Works particularly well with NiAu pad finishes.

Cobar, www.cobar.com

i-SAC 387 contains cobalt for improved melting, shiny solder joints, fine grain microstructure. Also contains germanium as an antioxidant. Has a melting point of 217°C and a specific gravity of 7.5 g/cm3.

i-SAC105 has silver composition of 0.5-1.5%, and contains cobalt for bright, shiny solder joints and fine grain microstructure, and germanium. Has a melting point of 217° to 227°C and a specific gravity of 7.4 g/cm3.

Balver-Zinn, www.balverzinn.com

MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels. Is noncontact and reportedly does not affect conductors or components near the cutting channel. System software imports data directly from popular layout programs. Handles boards up to 229 x 305 mm (9” x 12”). Integrated vacuum table holds boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.

LPKF, www.lpkf.com

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