Productronica 2011 Products
HR 600 hybrid rework system features bottom-side heating (2400W) divided into three independent heating zones. Hybrid topside emitter provides 800W of heating power and combines infrared and convection heating. Uses closed-loop technology. Component temperature is measured and can be controlled exactly. Noncontact temperature measurement performed via digital IR sensor (pyrometer). Optional visual process control and dip-and-print processes for solder paste or flux application. Can be adapted modularly and step by step for future rework requirements. Footprint about 85 x 60cm.
ERSA, www.ersa.com
HS70XL inline SPI handles printed circuit boards up to 22 lbs (10kg). Features sensor head camera, timing conveyor belt, and four sets of motors. Uses dual CPUs to handle data. Measuring speed is 80cm2/sec. at 20x10 micron resolution, and 40cm2/sec. at 13x7 micron resolution. Inspects smaller than 01005 pads and sizes as small as 100u microns.
Parmi, www.parmi.com
NXTP-M25 screen printer has two lanes for increased throughput and changeover. Features one-sided operation and the ability to place machines back-to-back. Mask accuracy reportedly is ±10 um. Features low-impact clamping to reduce warpage when panel is clamped. Optional automatic solder supply method minimizes waste.
Fuji Machine Manufacturing Co., Ltd., fuji.co.jp
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