As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

Indium Corporation’s proven SiPaste® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Water-soluble SiPaste® 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules. The newly released SiPaste® C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.

As the industry leader in no-clean semiconductor flux, Indium Corporation will also feature the first low-residue no-clean, ball-attach flux on the market, NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process. NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

NC-809 offers:

• High tackiness to eliminate die tilting or shifting during reflow; greatly reducing electrical open failures

• Consistent flux deposition and excellent wetting

• Ultra-low residue; ideal for customers building tight-pitch flip-chip assemblies

• Compatibility with a wide variety of underfills

• Reduced warpage of package and lower thermal stress due to absence of cleaning step

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

About IMAPS

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

Austin, TX – September 2022 – Austin American Technology (AAT) is pleased to announce that it has further expanded its brand by adding Restronics as its new representative/distributor in Southern California. Andy Black, Managing Partner, and Brad Lemmen, Manufacturers’ Representative, will represent AAT’s industrial grade batch cleaners, in-line cleaners, solvent cleaners, stencil cleaners and more.

Justin Cody Worden, Director of Business Development, commented: “I have spent the majority of my adult life living in San Diego and know how important it is to have top quality support and representation in this part of the country. Restronics provides the experience and resources needed to make sure every customer is properly supported with the AAT brand.”

Restronics’ national structure and centralized marketing resources enable its salespeople to spend more time with end-user customers and less time with non-selling activities. Mr. Black covers San Diego County, Orange County, Inland Empire and Southern Nevada. Mr. Lemmen’s territory includes: Los Angeles, Ventura, Santa Barbara, San Luis Obispo and Kern Counties.

Restronics’ Southern California team represents some of the leading product lines in the electronic manufacturing equipment and supplies industry. The company takes a consultative approach to determine and represent the perfect solution for its customers’ PCB and medical device manufacturing needs.

AAT cleaners are design-driven by the science of cleaning. They are used for the following applications: Printed Circuit Board (PCB) Cleaning, Surface-Mount Technology (SMT), Stencil & Misprint, Flip Chip, and BGA, in several industries including: automotive, medical, military, and aerospace. All cleaners are manufactured and built to each customers’ specific needs in Austin Texas.

For more information about Restronics SoCal, contact Andy Black at (858) 449-3128 or email ablack@restronics.com.

For more information about Austin American Technology, please visit www.aat-corp.com.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

2022-09-15 – Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection solutions, is eager to explain how optical inspection drives Electronic Vehicle (EV) reliability upwards. We will present sessions on 22 September 2022 in Chinese and on 29 September 2022 in Japanese. Our panel of technology and application experts will be available following the presentation to field questions about EV inspection solutions during a live panel session.

During the presentation, we will explore relevant EV technologies and trends by incorporating specific real-world application challenges and solutions. Attendees will be presented exclusive information about how several different Koh Young solutions will improve manufacturing yield and quality across several stages of the production process.

Register now for the online seminar “Optical Inspection Drives EV Reliability” by clicking the “Register Now” link or visit our website www.kohyoung.com. During registration, you may submit specific questions for our panel of experts to address during the live Q&A session.

Date Time Language Registration

Thursday, September 22, 2022 3:00PM Beijing Time (BJT) Chinese https://meeting.tencent.com/dw/PZaocp1FM7X8?ch=kQoV1nr3JNr2x

Thursday, September 29, 2022 11:00AM Japan Standard Time (JST) Japanese https://us06web.zoom.us/webinar/register/1716624464292/WN_g2d_j4MISDW4ylvvd0iCMg

If you cannot attend Koh Young Future Forum 2022, you can still learn more about Koh Young and its award-winning solutions by visiting our website at www.kohyoung.com.

About Koh Young Technology, Inc.

Established in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative solutions for challenges with Machining Optical Inspection (MOI), Dispensing Process Inspection (DPI), and Semiconductor Packaging Inspection (MEISTER Series). Through its technology innovations, Koh Young has secured thousands of global customers, and maintains the largest global market share in the SPI and AOI markets. Additionally, by adopting its user-centric R&D activities, it continues to use its core competencies and develop innovative solutions for new and existing markets. Its activities stem from the corporate headquarters in Korea to its global sales and support offices in Europe, Asia, and the Americas. These local facilities ensure it keeps in close contact with the market, and more importantly, its growing customer base to provide access to an award-winning network of inspection and measurement experts. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at kohyoung.com.

For More Information

Koh Young Technology, 14F Halla Sigma Valley, 53 Gasandigital 2-ro, Geumcheon-gu, Seoul, Korea 08588 marketing@kohyoung.com www.kohyoung.com

(Waterbury, CT USA) – September 15th, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present two papers on its latest low temperature solutions at upcoming SMTA Expos, the first at SMTA Guadalajara which will be held at the Expo Guadalajara from September 21 – 22, and the second at the SMTA Empire in New York on September 27.

Francisco Gallegos, Customer Technical Support Engineer at MacDermid Alpha will present the paper, ‘Low Temperature Soldering: Traditional Sn-Bi based alloys and latest developments in high reliability alloys for SMT and PTH applications’ at 10.30am CT on Wednesday 21st September at the SMTA Guadalajara Expo. The paper will discuss MacDermid Alpha’s latest low temperature innovation, ALPHA OM-565 HRL3 solder paste. Designed to mitigate warpage induced defects in temperature sensitive chip-scale packages, the solder paste enables peak reflow of 175°C to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP).

Lily Zeiler, District Sales Manager for Northeast US at MacDermid Alpha will present, ‘Low Temperature Soldering: Why LTS is Now a Potential and Viable Option for Many Applications’ at 1:00pm EST on Tuesday 27th September at the SMTA Empire Expo. The paper will discuss how by enabling lower peak reflow temperatures, low temperature solders offer manufacturers considerable process, reliability, and sustainability benefits for a broad range of applications.

In addition to its low temperature technologies, including ALPHA OM-565 HRL3, MacDermid Alpha will also promote its range of ALPHA HiTech adhesives, underfills, edgebonds and encapsulants at both expos. The ALPHA HiTech range of polymer materials are designed to provide enhanced protection for assembled chip components for a broad range of applications including automotive, camera module and mobile. Also featured will be MacDermid Alpha’s Reclaim and Recycling Program, which provides a safe and efficient service enabling customers to meet their environmental and legislative requirements, and at the same time maximize the return on their waste streams.

Visit MacDermid Alpha at booth #300 at the SMTA Guadalajara Expo and the MacDermid Alpha table at SMTA Empire for more information on our high reliability and low temperature solutions. To register for these SMTA Expos please visit: Events - SMTA

To learn more about MacDermid Alpha’s circuit board assembly solutions please visit: macdermidalpha.com

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.