QUERETARO, MEXICO – ROCKA Solutions is pleased to announce that it has finalized an agreement to represent and distribute actnano’s products in Mexico, Brazil and Argentina. actnano’s gel-state ANG coatings protect electronics from damage due to harsh environmental conditions and can be applied using coating equipment that is standard to any electronics manufacturing facility.
Advanced nanoGUARD (ANG) is the only thin-film polymer that can be applied on the entire PCBA including the connectors, which provides higher levels of protection and lowers operational costs. Rodrigo Cacho, ROCKA President & CEO comments, “This is a new technology in terms of conformal coating and will be a gamechanger for the industry.”
actnano is a revolutionary nanotechnology company that enables the protection of a variety of materials from water damage and harsh environmental conditions. Specializing in automotive and consumer electronics, actnano’s thin-film coatings provide up to IPx8 protection levels. The viscoelastic and electrical insulation properties of nanoGUARD coatings allow for complete PCBA protection. actnano’s coatings protect complex topographies while still allowing for electrical connections to be made without trapping heat in high power components or attenuating digital signals during information transfer.
Only nanoGUARD offers a 100 percent fluorine-free solution that is REACH and RoHS compliant. For more information, visit https://actnano.com/
WATERBURY, CT – MacDermid Alpha, one of the world’s largest providers of solutions for circuitry, assembly, and semiconductor manufacturers within the electronics industry will present its latest research on high-speed copper plating at the 19th Annual Device Packaging Conference (DPC 2023), held March 13-16, at the We-Ko-Pa Conference Center in Fountain Hills, Arizona. Engage the industry experts at booth 31-32, where MacDermid Alpha will showcase the performance benefits of advanced materials for die attach, chip fabrication, and wafer-level packaging.
Sean Fleuriel, Research Chemist, will present a paper at the technical conference, titled “High-Speed Copper Plating Process for IC Substrate”. In this paper, Sean presents findings from an acid copper electrolyte utilized for plating 2-in-1 redistribution layers (RDL), with small vias and fine lines down to 10µm wide. The electrolytic process successfully plated these features, while maintaining a uniform surface across the panel that met the demanding physical requirements for IC substrate applications. Sean will explore the new high-speed findings in greater detail, revealing new degrees of control unavailable in VCPs, and cover the benefits of the high-speed tool to reduce plating time.
MacDermid Alpha is powering the future of advanced semiconductor solutions that exceed demanding packaging design requirements and help overcome the challenges of miniaturization thereby enabling greater device reliability. Highlighted at the show will be:
Additionally, for solutions designed for the challenges of power electronics, MacDermid Alpha will share information on the latest capabilities of the ALPHA ® ARGOMAX ® portfolio of sinter materials and ATROX ® conductive and non-conductive die attach pastes and films will be available. ALPHA ® ARGOMAX ® engineered sinter materials are proven to have the best process times and reliability while providing flexible and easy-to-use form factors that reduce the capital cost and time to market. ATROX ® conductive die attach products are an enabler for package shrinkage and higher power density packaging, designed for excellent workability and processing, and offer proven performance across a range of exposed pad power packages.
Let’s start a conversation at booth 31-32; the team from MacDermid Alpha will be ready to discuss how to elevate your process with an integrated ‘start to finish’ roadmap featuring some of the most advanced technologies on the market, backed by extensive R&D facilities, a robust supply chain, and extraordinary customer service. Established brands aligned under MacDermid Alpha Electronics Solutions include Alpha ® , Compugraphics, Electrolube ® , Kester ® , and MacDermid Enthone ® . MacDermid Alpha will resolve your pain points today, tomorrow, and beyond. Discover how we make a difference by visiting www.macdermidalpha.com
GAINESVILLE, GA ― Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, manufactures RPS Automation Selective Solder Risers for the Opus range of selective soldering machines. The nozzles are machined from special alloy steel with N65 magnets. The easy drop-in replacements are designed for long-lasting, dependable performance.
As selective soldering continues to become more popular in the electronics manufacturing industry, Count On Tools has realized the need for higher quality selective solder nozzles that can consistently apply flux and solder to component leads without disturbing nearby SMT components. Count On Tools custom selective solder nozzles assist to replace labor-intensive hand soldering while eliminating defects caused by wave soldering machines in the market’s most popular selective soldering equipment.
Additionally, Count On Tools offers custom selective solder nozzles based on specific application requirements. This includes special wave form sizes and extended or shortened lengths. Generally, these nozzles can be completed in 3-5 days with savings up to 50 percent less than OEM nozzles.
Being a one-stop shop, the company strives to offer the widest range of SMT nozzles and consumables as possible. All COT products are NEW and meet or exceed all OEM specifications. COT parts are a direct replacement, ultimately saving over buying directly from the OEM.
Count On Tools is a leading provider of precision machined components, SMT spare parts and Swiss-made hand tools, locally and globally. The company has won numerous awards for its quality products and service. Count On Tools holds and maintains current ITAR registration, 07FFL, 02SOT, and a first-class Quality Management System. For assistance with SMT needs or quotes for in stock items, contact sales@cotinc.com
COHOES, NY – PVA, a global supplier of automated dispensing and coating equipment, today announced plans to exhibit at The ASSEMBLY Show South, scheduled to take place April 4-6, 2023 at the Music City Center in Nashville, TN. The PVA team will highlight the Valve Tool Changer in Booth #553.
The ASSEMBLY Show has been a staple in the industry for 10 years, and now the organizers are bringing the show to the U.S. South, where manufacturing is growing and thriving at an unprecedented rate. Join PVA in Nashville, TN and connect face-to-face with like-minded peers, learn from business thought leaders, and uncover emerging trends and technologies related to assembly technology equipment and products.
PVA’s new Valve Tool Changer feature increases the number of applications each machine can satisfy without sacrificing valuable work area. The Tool Changer can accommodate four additional valves in the machine that can be automatically picked up and used at any time.
PVA is a world-class innovator of high quality, repeatable dispensing and conformal coating systems. The company manufactures turnkey solutions that help customers improve their competitiveness, such as coating inspection, optical bonding and curing ovens.
The PVA team will be available to answer questions about coating and dispensing, as well as other application solutions in the PVA line-up such as coating inspection, optical bonding and curing ovens.
For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.
BILLINGSTAD, NORWAY – Kitron has received an order with a value of more than NOK 180 million from Kongsberg Defence & Aerospace (KONGSBERG).
The order is for military tactical communications equipment for the defence market developed and produced by KONGSBERG.
“Electronics for advanced communications equipment constitutes a key part of Kitron’s business within the defence market, and we see solid growth in this segment. Therefore, we are extremely pleased to receive this order from KONGSBERG,” said Hans Petter Thomassen, Managing director of Kitron Norway.
Deliveries will start in 2024 and continue into 2025. Production will take place at Kitron’s facility in Arendal, Norway.
MANASSAS, VA – ZESTRON, is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will present a technical study, "Defluxing of Copper Pillar Bumped Flip Chips" at the International Microelectronics Assembly and Packaging Society’s (IMAPS) Device Packaging Conference on Tuesday, March 8th. His presentation is part of the Fan-Out, Wafer Level Packaging & Flip Chip Track Session TP2: WLP & Flip Chip: Process & Materials (2:00 – 5:30 pm)
In comparison to wire bonding technology, flip chip technology provides higher packaging density (more I/Os), higher performance (shorter possible leads, lower inductance), smaller device footprints and lower packaging profile. Copper Pillars are likely to become the most dominant type of flip chip interconnect in the coming years because they allow for pitches down to 40µm as well as improved electrical performance. However, post-solder flux residues can affect reliability and underfill, leading to delamination and voids. “Our study focuses on the impact of flux cleaning using straight de-ionized water and novel low-concentration aqueous cleaning agents on copper pillar bumped flip chips. The benchmark established in this study helped with Phase II study involving bump pitches lower than 15µm and denser packages. We are excited to present our findings at the IMAPS 19th Device Packing Conference” said Ravi Parthasarathy.
ZESTRON is a leading provider of cleaning solutions for the semiconductor industry focusing on advanced packaging including stacked copper pillar, FOWLP (2.3D/2.5D/3D) and and fCBGA packages. With ZESTRON’s cutting-edge technologies and experienced team of engineers, ZESTRON offers innovative and reliable cleaning processes for power electronics, advanced packaging, and wager bumping processes.
To learn more about ZESTRON’s capabilities within the Semiconductor industry, click here to download informational flyers: https://pages.zestron.com/semiconductor-flyers