TOKYO — Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, will join NEPCON Japan 2023, held at Tokyo Big Sight from January 25 – 27, 2023, to showcase state-of-the-art Test and Inspection Solutions for the Smart Factory. Visit booth #14-38 to experience the latest test and inspection innovations for the PCBA Industry. TRI welcomes you to join us at NEPCON Japan to learn how TRI's AI algorithms and metrology help boost your production intelligence.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. Also, TRI will unveil the 3D AOI TR7700QM SII for high-reliability industries with superior specifications of a 25MP camera, 2.5 um high- resolution, AI-Powered, and Metrology Ready.
Also presenting at NEPCON Japan will be the 3D SPI TR7007QI and the world-class High-Speed 3D CT AXI TR7600 SIII for multiple industry applications. The most compact ICT in the market, TR5001T SII Tiny, will be showcased. The AI solutions from TRI include AI Smart Programming, AI Repair Station, and more. TRI's test and inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX. Join us at NEPCON Japan 2023 booth #14-38 to discover why the leading EMS companies choose TRI as their Test and Inspection Partner.
STOCKHOLM — Ericsson (NASDAQ: ERIC) today announced it is scaling up the production capacity and operations with its partner Jabil in Pune to meet the needs of 5G network deployments in India. Ericsson, the first telecom vendor to set up manufacturing in India in 1994, manufactures equipment with Jabil that includes 4G and 5G radios, RAN Compute as well as microwave products.
Nunzio Mirtillo, Head of Market Area Southeast Asia, Oceania and India, Ericsson, says: “As 5G gets introduced in India, we are ramping up production of our 5G telecom equipment in Pune in a phased manner, to support the network deployments of Indian telecom service providers. The production in India is part of our global production footprint with a presence across continents. This footprint has enabled us to secure a global, flexible, and resilient supply chain to respond quickly to market and customer needs, whereby India also benefits.”
The production ramp-up will expand operations with high-technology production and will also generate employment for around 2,000 people in Pune, India. To increase flexibility and speed in bringing products into the market, Ericsson India is also establishing a technology center. This will focus on new product introduction and production engineering to secure high-quality standards, testing/integration, and supply preparations on early-phase products, as well as operational support to ensure efficient 5G development and deployment in India.
Ericsson’s ultra-lightweight, Massive MIMO antenna integrated radios AIR 3219 and AIR 3268 will be produced there initially to support the 5G deployments. Ericsson will also work with local ecosystem partners to support its 5G production in India.
Commercial launches of 5G networks are underway in the country with deployments having commenced following the spectrum auctions in July. Bharti Airtel (Airtel) and Jio, India's premier communications solutions providers, have selected Ericsson as their partner to deploy 5G networks in the country.
“With our experience of deploying 5G in more than 50 countries, we look forward to the opportunity of helping our partners to seamlessly transition to 5G,” says Nunzio Mirtillo. “5G is a platform for innovation that will transform India by digitalizing industries and providing new and immersive experiences to consumers. 5G can play an important role in achieving India’s digital inclusion goals and enable the country to realize its ‘Digital India’ vision.”
With increasing availability and affordability of 5G smartphones, along with rapid adoption of smartphones in urban and rural areas, 5G subscriptions in the India region are expected to rapidly increase to reach around 690 million by the end of 2028, according to the Ericsson Mobility Report, November 2022 edition.
NEWMAN LAKE, WA — Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vishay Israel Limited has purchased Pulsar solderability testing and Photon steam aging systems for installation in their Beer Sheva, Israel facility. The Pulsar utilizes the highly proven dip-and-look test method that is a qualitative type test performed by comparative analysis.
The Pulsar solderability test system complies with all applicable solderability test standards including MIL- STD-883 Method 2003, IPC J-STD-002 and MIL-STD- 202 Method 208. The Photon steam aging system is used for accelerated life testing to simulate elongated storage conditions for high-reliability applications. These steam aging systems complement component lead tinning machines designed to perform component re-tinning, tin whisker mitigation, gold removal and BGA de-balling for high reliability and military applications.
NORTH BILLERICA, MA — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced the appointment of Assembly Resource as its new exclusive distributor for reflow soldering systems in Northern California and Northern Nevada.
Leigh Jackson and the team at Assembly Resource will provide sales, technical and after sales support for BTU’s high-performance reflow ovens and custom furnaces. Since 1950, BTU has been the partner of choice for manufacturers facing the most complex thermal processing challenges.
“BTU’s reflow ovens are widely recognized as the best performing ovens available in the market today,” said Leigh Jackson of Assembly Resource. “We are excited to take BTU’s products into new applications and projects in our territory.”
As one of the established manufacturers’ representatives in the vital Northern California, Northern Nevada and Silicon Valley territories, Assembly Resource is focused on providing superior sales representation and support for its customers and principals. As technology and equipment for Micro-Electronics, Semiconductor Packaging and SMT Assembly become more closely aligned, Assembly Resource’s product offerings and expertise take advantage of this newly developing synergy to provide timely solutions and valuable knowledge.
“We look forward to partnering with Assembly Resources in Northern Cal and Nevada,” said Chris Heesch, Regional Sales Manager at BTU. “Leigh and his team take excellent care of their customers, and have excellent process knowledge to foster success in this important high-tech region.”
With more than 20 years’ experience in PCB Surface Mount Technology (SMT), through-hole, Micro-Electronics and Semiconductor Assembly, Mr. Jackson has a significant background of sales success, detailed product demonstrations and assembly process consulting. He has worked directly for many leaders in the electronics industry and as a manufacturers’ representative providing direct sales, product demonstration, process and marketing consulting.
Fore more information about Assembly Resource, email Leigh@AssemblyResource.com or visit www.assemblyresource.com.
To learn more, visit www.btu.com.
FREMONT, CA ― Anda Technologies, a leading provider of fluid application and custom automated manufacturing equipment, today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will highlight its total selective coating and fluid dispensing line solutions along with the AP-3 Series inline surface plasma treatment machine in Booth #1533. Additionally, the IPC APEX EXPO will be the first show appearance for their TVS-400 tabletop precision dispensing machine.
Anda’s TSV Series are versatile, compact, high-speed precision tabletop dispensing machines designed for selective coating and fluid dispensing applications. Due to their compact size, these dispensing machines are easily portable making them ideal for low volume processes or laboratory tabletop applications.
The TSV Series is an automated, XYZ (3-axes) gantry system driven by ball screw and servo motors. This dispensing machine series is available in two different models with varying platform work areas and X-Y travel dimensions. The TSV-300 model is 300 x 300 mm and the TSV-400 model is 400 x 400 mm.
Anda manufactures and supplies total coating and fluid dispensing line solutions for RTV, heat curable, and UV curable material processes. Anda also manufactures a wide variety of conveyors and provides solutions for every level of automation for coating and fluid dispensing processes. Their One-Man Operation (OMO) total line solutions offer many advantages over traditional process lines. Product flow input and output can occur at the same location within the line, allowing conventional manual flip for coating or dispensing on both sides of a PCB assembly.
HANAU, GERMANY — Heraeus Electronics will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase three innovative products designed to meet current and future SMT challenges. New solutions are needed to meet the increasing demands for miniaturization, reliability and TCO challenges.
Heraeus has answered the industry’s need, and will introduce the next evolution of Solder Paste to address these challenges in Booth #2419 during the IPC APEX EXPO.
The all-new paste system is a high reliability, high performance paste system with a competitive TCO offering. Based on proven experience of Heraeus Electronics, the new paste system allows a wide process window, enabling soldering in air with low defects. Additionally, it is designed to offer an optimized formulation for lower material costs. Moreover, the company will discuss its proven Innolot Solder Paste and mAgic® DA320 Sinter Paste.
Heraeus’ SMT 650 Innolot solder paste achieves a consistently high surface insulation resistance that prevents electrochemical migration. The combination of the flux system with Innolot alloy delivers superior reliability— especially in miniaturized systems in the automotive industry. In addition, the developed flux system can also be combined with SAC305.
mAgic® DA320 is a high shear strength, non-pressure dispensing sinter paste for die attach of power applications. With high thermal conductivity, it offers fast sintering at low application temperatures from 200°C and above to form quality interconnections.
For more information about the company’s innovative materials portfolio, visit Heraeus experts in Booth #2419 during the IPC APEX EXPO.
To learn more about Heraeus Electronics, visit www.heraeus-electronics.com