MILWAUKIE, OR — ECD today announced that it has hired Michael Pliska as its new Director of Engineering, supporting all product lines and market sectors. Pliska, who brings impressive credentials to the role, will leverage his extensive experience in mechanical engineering, software engineering and business management to implement systems that streamline development, capitalize on digital capability, and continue to offer ECD customers user-friendly process control technologies. The company is modernizing its entire thermal profiling, dry storage, and machine quality management product line-up. Pliska will oversee all engineering aspects -- from major ground-up NPI to more efficient revisions that improve manufacturability and reliability.
Before ECD, Pliska held several engineering management roles with companies in the automotive and bio-science markets. His previous responsibilities, as well as his physics research and coursework, focused on instrumentation innovation, making him the perfect candidate to head ECD’s Engineering department. Pliska looks forward to significantly contributing to the company’s ambitious new product development initiatives and leading the effort to centralize and formalize all engineering documentation.
“The Director of Engineering role at ECD was precisely the type of position I was hoping to find,” shares Pliska. “I’ve become accustomed to working at companies that lead in their respective product classes, and I’m thrilled to have landed at another organization where this is the case. Having worked at large and small firms managing engineering teams of all sizes, I hope to leverage my experience with the Taguchi method of quality engineering and integrate that into the uniquely agile and responsive approach found with smaller, more nimble businesses. Being able to oversee both the engineering management side and the technical elements of embedded controls and rugged electronics is the ideal role for me. I have found that at ECD.”
ECD President, Tara Fischer, is confident Pliska is the right person to execute ECD’s product growth initiatives. “We are set to launch a revolutionary new thermal profiling product in January 2023 and plan to keep our foot on the gas,” says Fischer. “Michael will be instrumental in helping us bring robust, innovative technology to market in an expedited fashion. His skill set is exactly what we were seeking, and we know his expertise will enable excellent results for ECD and our customers.”
Pliska holds a BS in Mechanical Engineering, an MS in Physics, and an MBA from Portland State University. He is based in ECD’s Milwaukie, Oregon headquarters.
REDDITCH, UK — Altus Group, a leading distributor of capital equipment for electronics assembly in the UK and Ireland, will once again exhibit the most innovative machines available in the marketplace at the Southern Manufacturing and Electronics 2023, taking place from 7 – 9th February 2023, at Farnborough International Exhibition Centre.
Highlights will include demonstrations of best-in-class equipment from leading suppliers in the industry. The team of experts from Altus will present emerging technology within the electronics sector and the processes that will help to improve production.
Joe Booth, Altus CEO said: “Southern Manufacturing and Electronics is an important date in our exhibition diary as it brings the electronics community together in one space. This gives Altus the ideal platform in which to introduce some of the world’s most innovative capital equipment.
“Following a year full of new partnerships and additions in 2022, we are looking forward to introducing visitors to the very best products including inspection systems, production equipment, component management solutions and consumables.
“We have also welcomed several new staff including Jiri Kucera, Altus’ new Operations Director. He is looking forward to meeting our current customers, and prospective clients at the show, and, together with our team of experts, will demonstrate the capabilities of the varied products in our portfolio.”
Highlights on the Altus stand will include equipment from Koh Young, including the Zenith Alpha HS+ 3D AOI inspection platform. Combining the best hardware and 3D algorithm technologies, and teamed with artificial intelligence, it delivers the first class accuracy for any inspection application.
Essemtec Fox smart sized modular pick-and-place machine will also be displayed which is dedicated to high-mix production. Another highlight will be Asscon Vapour Phase system. As the demand to produce complex PCBA technology grows, this market-leading flexible system includes adjustable temperature gradients to assure each product has the optimal, reproducible temperature profile.
With traceability and process control of the upmost importance in electronics production, Altus will also demonstrate Promation USA Robotic Soldering platform. Visitors can see first-hand how these systems can support their high-tech, high value production requirements. Building on the foundation of proven robotic soldering performance and know-how, and with the addition of an impressive suite of software functionality, this robotic soldering process fits seamlessly within Industry 4.0 ideals.
To view the most innovative technology for electronics production, and speak to our knowledgeable team, visit Altus on stand J130.
NEWMAN LAKE, – Hentec Industries/RPS Automation is pleased to announce that Tyvak Nano Satellite has completed the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re- conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF- 38524E and ANSI-J-STD-002 standards.
MENTOR, OH ― Libra Industries, a privately-held systems integration and electronics manufacturing services (EMS) provider, today announced the appointment of its new Vice President of Sales. Nathan Whipple brings business development experience spanning more than 37 years in multifaceted manufacturing environments.
A hands-on decision maker, Whipple is armed with a rich mixture of operations management and strategic sourcing experience. He is a proven leader with a demonstrated ability to maintain focus on strategic goals, while at the same time effectively leading the tactical activities to achieve those goals.
In his previous role as Director of Channel Partnerships, he established a network of 22 active representative organizations. His responsibilities included creating, leading and managing key strategic partnership programs with manufacturers’ representatives and key suppliers. Whipple brings his strong leadership, operations liaison and strategic account support skills to Libra.
Libra Industries continues to invest to provide customized manufacturing solutions for its customers’ complex product requirements. Through its broad range of capabilities, Libra offers its customers the most capable manufacturing team in the industry. For more information about Libra Industries, visit www.libraindustries.com.
SAN JOSE, CA — NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $8.45 million in funding (including $4.25M in cost-share contribution from participants) for nine new projects as part of its Project Call 7.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
Project Call 7.0’s awarded projects represent a diverse and innovative set of companies and universities that are jointly focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. Several projects in this latest round of funded projects focus on advancing additive manufacturing approaches for hybrid electronics and addressing critical needs in domestic advanced semiconductor packaging capabilities, which directly aligns with the needs described in the recently passed Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act.
Project Call 7.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This will include using water-based inks and lower temperature processing, as well as assessing the manufacturing reshoring of low-cost single use medical devices that utilize more environmentally sustainable manufacturing approaches and materials.
This latest round of funding brings the total amount invested in FHE developments to more than $124M, including cost share contributions from Project Call participants.
“I am pleased to announce these important new projects, which will enhance the state of the art in hybrid electronics, support national efforts for semiconductor package manufacturing, and help to transition an increasing number of new capabilities into the U.S. industrial manufacturing sector for further advancement of the industry,” said Malcolm J. Thompson, PhD, Executive Director. “The NextFlex member community is accelerating FHE and additively manufactured electronics toward commercialization in a number of critical application areas addressed in these projects.”
Project Call 7.0’s awarded funding will go to:
For more information about NextFlex and the Project Call program, please visit https://www.nextflex.us/project-call/
WATERBURY, CT — MacDermid Alpha Electronics Solutions, a global leader of integrated solutions for high performance electronics materials, design, and manufacturing, will highlight its latest polymer and solder paste offerings designed to meet the increasing demands for high reliability performance and protection at the upcoming SMTA Silicon Valley Expo taking place on December 8 at the Juniper Dome in Sunnyvale, California.
Featured solutions include MacDermid Alpha’s expanding portfolio of Electrolube and HiTech polymer materials engineered to meet the requirements for high reliability and protection for increasingly complex circuit boards. The Electrolube line of encapsulation resins, conformal coatings and thermal interface materials and the ALPHA HiTech line of underfills, adhesives and edgebonds are designed to deliver enhanced protection for assembled chip components for a broad range of applications including automotive, camera module and mobile.
Additionally MacDermid Alpha will promote ALPHA OM-565 HRL3, its latest low temperature solder paste which enhances electro-chemical performance over and above existing low melt point solders. This paste enables a reduction in peak reflow down to 175°C in order to mitigate common warpage induced defects such as Head-in-Pillow and Non-Wet-Open to improve assembly yields. Discover more about these and all the MacDermid Alpha product and services that support all steps of device manufacturing within every segment of the electronics supply chain at SMTA Silicon Valley on December 8 and visit MacDermidAlpha.com.