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Austin, TX – June 2021 – Austin American Technology (AAT) is pleased to announce that it has successfully completed the installation of a Mega ION® SA at KYZEN’s Applications Lab in Nashville, TN.

The Mega ION SA is the perfect addition to KYZEN’s Applications Lab for cleaning test requiring a semi-aqueous process. The Mega ION SA rinses with de-ionized water rather than using a solvent to both wash and rise.

Ram Wissel, KYZEN’s Technology Manager stated, “KYZEN is excited to add the Mega ION® SA to our Nashville Applications Lab. This semi-aqueous wash provides an efficient alternative for devices that are sensitive to high-impact energy aqueous spray or ultrasonics. Today’s challenging flux residues are removed by matching them with the optimal solvent-based cleaning agent and a simple water rinse.”

KYZEN’s Applications Labs are equipped with the latest analytical equipment and staffed with a team of highly trained chemists to provide support to our customers worldwide. These resources are key to ensuring your process is and remains a robust process by profiling the wash bath and providing guidance for corrective action if necessary. KYZEN’s Applications Labs provide its customers with unparalleled laboratory services to see them through a wide range of problems.

The Mega ION cleaning system is designed for high reliability applications requiring product cleanliness verification (IPC ROSE Testing). It is used for final clean prior to conformal coat, encapsulation or other sealing operations used to protect electronic modules.

Science and Care truly Converge in KYZEN’s Applications Laboratories located around the world. For more information about KYZEN, visit www.kyzen.com.

For more information about Austin American Technology, please visit www.aat-corp.com.

About Austin American Technology:

Austin American Technology is on the forefront of engineering and manufacturing high performance cleaning system for over 35 years, delivering solutions worldwide. AAT was founded in 1986, as a provider of SMT rework systems and process engineering testing services. In 1988, their focus shifted toward the high-end electronics cleaning segment with the introduction of the world’s first automated stencil cleaner. In 2000, Austin American Technology became a market leader in inline cleaning systems with the introduction of the award-winning HydroJet® series. Patented cleaning and drying technologies were incorporated into an energy and space-efficient format to set new standards for performance and low cost of ownership. Building on this success, AAT introduced the MicroJet® inline flip chip cleaner to provide high volume cleaning capability in a small footprint. In 2013 AAT introduced the world’s smallest most efficient inline cleaner, the NanoJet®.

MADISON, AL – June 2021 - STI Electronics, Inc., a full service organization including engineering, contract manufacturing and training services announces it has successfully completed certification for QML IPC-1791.

Under IPC's Validation Services Program, STI Electronics, Inc. has earned an IPC-1791 Qualified Manufacturers Listing (QML) certification. The company continues to be a trusted source and supplier, meeting the stringent requirements for the electronics industry’s newest most comprehensive system for supply chain security. STI is listed and recognized as an IPC trusted source capable of delivering secure systems in accordance with industry best practices.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.

¬About STI Electronics, Inc. Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and contract PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. For more information, visit www.stiusa.com.

HORSHAM, Pa.--(BUSINESS WIRE)--Aegis Software, a global provider of Manufacturing Operations Software (MOM/MES), announces that Europlacer has expanded its 20+ year reseller relationship, for Aegis’ FactoryLogix® Digital Manufacturing Engineering software module, to now include China. Additionally, Europlacer is the first placement systems provider to achieve IPC Connected Factory Exchange (CFX) qualification, thereby enabling “plug & play” IIoT connectivity with Aegis’ FactoryLogix Platform, as well as any CFX-qualified factory information systems. With Europlacer and Aegis Software, manufacturers can effortlessly leverage IIoT data to monitor, control, and improve factory automation without requiring IIoT middleware or custom coding.

Europlacer Expands Existing Reseller Relationship with Aegis Software. Reseller Agreement Expands to China, and Europlacer Achieves IPC CFX Qualification for Plug & Play IIoT Connectivity with Aegis’ FactoryLogix Platform

“Now more than ever, manufacturers are seeking ways to become more agile and resilient. Foundational to achieving that desired agility and resiliency is a factory that can support seamless connectivity of machines, systems, and devices to provide the necessary levels of control, visibility, and efficiency without complexity, endless customization, or high costs. Europlacer and Aegis share a common goal of enabling factories of any size worldwide to achieve Industry 4.0 benefits. We are very proud of the long-standing synergistic and collaborative relationship that we have with Europlacer and look forward to continued success,” stated Jason Spera, CEO, and Co-Founder, Aegis Software.

About Europlacer

Founded 50 years ago, the Europlacer Group (formerly known as Blakell Europlacer) is active and pre-eminent in the electronic circuit board assembly sector with advanced product and service solutions for electronics manufacturers in the USA, UK, France, China and globally. Europlacer manufactures component placement as well as screen printing equipment used worldwide in surface mount assembly processes. The company also delivers full line solutions incorporating a range of associated equipment, including AOI, reflow and PCB handling.

Visit www.europlacer.com to learn more.

June 22, 2021 - Haverhill, MA, USA - Circuit Technology Center announces that it has issued a purchase order to RPS/Hentec for two additional Odyssey 1325 robotic hot solder dip (RHSD) machines. The Odyssey 1325 is a MIL spec complaint, high-volume, high-mix component lead tinning machine equipped with auto load/unload and is capable of processing dual solder alloys. The equipment complies with all applicable GEIA-STD-006, J-STD-001 and IEC TS 62647-4 standards.

This purchase will double the existing capacity of Circuit Technology Center's component level modification services department to meet the increasing demand from the defense and high reliability customer base that require component level modification/alteration for tin whisker mitigation, gold mitigation and lead re-conditioning applications. This state-of-the art equipment is also used for automated, touch-less BGA component de-balling, required as part of converting BGA’s with lead free solder to tin-lead solder.

"For nearly 40 years, leading defense and aerospace companies have relied on Circuit Technology Center as the world leader in circuit board level modification and damage repair services," said Andy Price, Sales Manager at Circuit Technology Center. “We are thrilled to announce this capacity expansion, offering our defense and high reliability customers component level modification and alteration services with the same level of exceptional quality and service that they have come to expect from our company.”

Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world.

For more information, please visit: www.circuitrework.com. Phone: 978-374-5000, Fax: 978-372-5700, Web: www.circuitrework.com.

DALLAS, TX ― June 2021 ― XDry Corp., a leading supplier of humidity-controlled storage cabinets for manufacturing, laboratories and preservation, today announced an exclusive representative agreement with Sandy Chew of MaRC Technologies in Northern California and Northern Nevada.

“We are honored to be partnered with XDry to provide exceptional dry storage solutions to our customers,” comments Mike Gunderson, President of MaRC Technologies. “Sandy’s dedication to servicing our customers has been exceptional and aligning with great principals like XDry allows for a winning combination.”

Chew’s professional approach to servicing high-tech customers has been developed and refined over her years in the industry. As a goal-driven professional that is self-motivated and results driven, her team player approach has been very valuable to both her customers and the companies she has worked for.

Chew is an excellent communicator capable of promoting her represented companies’ product benefits at both the executive and technical levels. She is an experienced leader of cross functional teams who can drive customer requests, market requirements, and trends through integrated hardware product life cycles. Chew holds her BS in Mechanical Engineering.

XDry cabinets are the perfect solution for printed circuit board and moisture sensitive component storage. For more information, visit www.XDry.com.

About XDry Corp.

XDry has more than 15 years of experience manufacturing dry cabinet storage systems. Founder Kevin McCarten was an early pioneer in the design of humidity-controlled storage – also known as auto-electronic desiccator storage cabinets. XDry offers a wide selection of dry storage cabinets to choose from, including storage for printed circuit boards, moisture sensitive devices (MSD), optics, laboratory equipment, industrial equipment, collectables, media and more. For more information, visit www.XDry.com.

5G is reaching the mass market. Is it an opportunity for RF front-end legacy players? Will the Chinese companies be part of this dynamic?

LYON, France - June 17, 2021 | “A sharp transition toward 5G is ongoing in mobile devices.” asserts Cédric Malaquin, Technology & Market Analyst, RF Devices & Technology at Yole Développement (Yole). He adds: “The number of 5G phones will more than double in 2021 compared to 2020. This is a significantly faster penetration rate than the LTE standard 10 years ago. And 5G is leading to an unprecedented increase in content of RF devices, while previous radio standards still need to be supported”.

As a result, hundreds of RF components must be fitted into handheld format devices. This is now impacting mid-tier and entry-level phones, not only flagships. 5G features implemented in handsets focus on improving download speed and make the uplink more robust. In addition, there is an entirely new radio path created at mmWave frequencies, though this only applies to flagships right now.

The cellphone industry has entered a transition toward 5G.

First use cases of the technology have matured and MNO are proposing new services to the consumer. MNOs are strongly motivated to invest more resources and to demonstrate 5G’s added value to the consumers, as 5G is not the first thing they are thinking about. In addition, MNOs have developed advantageous commercial 5G packages, particularly in China, adding some more motivation to consumers to upgrade.

In this context, 5G has strongly penetrated the smartphone market in 2020 and is expected to further grow as the network is expanding in China, in Europe and in the USA.

A 5G phone is relatively more complex than a 4G phone at the RF front-end level. Therefore, it’s worth analyzing the technical trends and anticipating future changes to understand this complex market better. Indeed, as for every new air standard, 5G represents a significant opportunity for industry players to differentiate, innovate and win the market in the end.

Released today, the Cellular RF Front-End Technologies for Mobile Handset 2021 report gives Yole’s analysts view on the RF front-end market evolution and its associated ecosystem.

In addition, the reverse engineering and costing company, System Plus Consulting, offers in-depth semiconductor technologies analysis, including RF solutions in its Smartphone Design Win Quarterly Monitor. Read the dedicated article here. Also, the company proposes a technical and cost overview of the evolution of RF front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones in 2020 in the RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset report.

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