MORRISVILLE, NC  May 2022  Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and subsidiary of Juki Corporation, is pleased to announce that BayaTronics has purchased a complete Juki line for its new facility. Located in Concord, North Carolina, BayaTronics is a global technology, supply chain and manufacturing solutions partner. The sale was facilitated by Bob Doetzer with Circuit Technology.

BayaTronics’ new facility is state-of-the-art, outfitted with all of the latest Juki SMT equipment, including: a G-Titan APD Screen Printer, two RS-1R Placement Machines, an 8-Zone Air Reflow Oven, iCube-DN inline selective solder, Incoming Material Station, ISM3600 Intelligent Storage Tower and ISM500 Intelligent Storage Cabinet.

Dirk Warriner, Co-Founder & CEO, BayaTronics commented about the new Juki line: “BayaTronics is pleased to have partnered with Juki and Circuit Technology to ramp up this state-of-the-art PCB assembly shop. We knew we had to get the best-in-class for all our equipment and get our staff fully trained and certified. We are proud to have accomplished this in a short period of time and are positioned to produce high quality electronics assemblies for our customers. We look forward to hosting our customers and prospective customers to tour our facility.”

Founded in 2021, BayaTronics has big plans for future growth and expansion. Design and production volume determines material cost, which has a major impact on the overall cost of a product. BayaTronics assists its customers with design for manufacturability, new product introduction, and the procurement of materials without burdening the customer with excess material cost.

“BayaTronics didn’t cut any corners and are now poised for success,” stated Doetzer. “The ownership group recognized the need to invest in state-of-the-art equipment and process controls to adequately handle today’s complex assembly challenges. They set up a first-class manufacturing facility that is ready to put out high quality PCB assemblies.”

It is the goal of BayaTronics to provide domestic customers with a high volume, cost competitive solution with superior quality. The company offers printed circuit board assembly (PCBA), final assembly and material management. Dedicated staff manage each customer’s end-to-end supply chain requirements.

For more information about BayTronics, visit www.BayaTronics.com.

ACE Convergence Acquisition in a regulatory filing said it has postponed Thursday’s shareholder vote on the proposed merger with Tempo Automation, a software-accelerated electronics manufacturer.

The SPAC in the filing said it needs more time to finalize financing for the deal, which has a $919 million estimated post-transaction equity value.

ACE said it would announce a new meeting date at a later time.

The SPAC has already disclosed multiple funding sources, including:

• $230 million from cash in trust by ACE, assuming no redemptions
• $82 million fully committed PIPE anchored by Point72 Ventures Investments and ACE Equity Partners with participation from Firsthand Funds and Lux Capital.
• Tempo also has $200 million in convertible notes financing, most of it from Oaktree Capital.

In addition, the companies announced in March that they had acquired a $100 million equity facility for post-merger needs. The equity facility would be provided by an affiliate of Cantor Fitzgerald.

Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at the International Microwave Symposium, Denver, Colo., June 19–24.

Indium Corporation is the leading solder supplier for laser, optical, and RF microwave applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible. Semiconductor laser and RF power die-attach applications require the highest quality, ultraprecise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly-reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:

• Highly accurate thickness control

• Precision edge quality, virtually burr-free

• Optimized cleanliness control

• Default waffle-pack method

Indium Corporation’s AuLTRA™ 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA™ 75 helps improve the operation of these critical technologies by offering a lower gold content, allowing for the absorption of gold from the die, and thereby ensuring a strong solder bond.

AuSn preform solutions:

• Deliver improved wetting and voiding

• Allow for adjustment of the final solder joint composition

• Are available in 78Au22Sn and 79Au21Sn formulations

Indium Corporation’s AuLTRA™ ThInFORMS™ are 0.00035” thick (0.00889mm or 8.89μm) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA™ ThInFORMS™ help combat common issues such as:

• Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting

• Poor thermal transfer—the ultra-thin 0.00035” preform reduces bondline thickness, thus improving thermal transfer and increasing the longevity and performance of the device.

To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #9012 at the show.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

(South Plainfield, NJ USA) – May 4, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.

ALPHA Argomax AccuLam is the next revolution in Sintering Film, delivering higher throughput and larger area lamination compatibility whilst being uniquely customized for a customer’s requirements. The film is part of the range of ALPHA Argomax Sinter Process Solutions which also includes paste for printing and dispense and preforms specially engineered for Top Side Attach, Die Attach, Wafer Attach and Package Attach processes.

A key highlight at the MacDermid Alpha booth will be demonstrations of ALPHA Argomax in the package attach process using a sintering press. The successful sintering of molded power packages is possible due to the lower pressure, lower temperature, and faster sinter times enabled by ALPHA Argomax. The paste ensures intimate contact between the package and the heat-sink, accommodates warpage, and sinters with low pressure without cracking the molded module. ALPHA Argomax, based on proprietary nano-particles technology, is the preferred sintering solution for package to heat-sink attach with demonstrated 10X improvement in power cycling reliability.

To register for PCIM Europe please visit: https://pcim.mesago.com/nuernberg/en.html

For more information on ALPHA Argomax AccuLam and the ALPHA Argomax range of Sintering Process Solutions please visit: macdermidalpha.com

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.