(South Plainfield, NJ USA) – May 4, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.

ALPHA Argomax AccuLam is the next revolution in Sintering Film, delivering higher throughput and larger area lamination compatibility whilst being uniquely customized for a customer’s requirements. The film is part of the range of ALPHA Argomax Sinter Process Solutions which also includes paste for printing and dispense and preforms specially engineered for Top Side Attach, Die Attach, Wafer Attach and Package Attach processes.

A key highlight at the MacDermid Alpha booth will be demonstrations of ALPHA Argomax in the package attach process using a sintering press. The successful sintering of molded power packages is possible due to the lower pressure, lower temperature, and faster sinter times enabled by ALPHA Argomax. The paste ensures intimate contact between the package and the heat-sink, accommodates warpage, and sinters with low pressure without cracking the molded module. ALPHA Argomax, based on proprietary nano-particles technology, is the preferred sintering solution for package to heat-sink attach with demonstrated 10X improvement in power cycling reliability.

To register for PCIM Europe please visit: https://pcim.mesago.com/nuernberg/en.html

For more information on ALPHA Argomax AccuLam and the ALPHA Argomax range of Sintering Process Solutions please visit: macdermidalpha.com

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.

Irvine, California, USA - Martin Hart, CEO of TopLine® Corporation, will present “Achilles Heel in the RadHard FPGA Supply Chain” at Space Tech Expo USA in Long Beach, California, May 24, 2022. Hart is a widely-known authority and product developer in the field of electronic components technology and a holder of multiple U.S. Patents. “Today, 90% of chip makers rely on a single hardware subcontractor to attach solder columns to space grade Radiation Hardened FPGA and Application Specific (ASIC) chips,” Hart says. “This is a recipe for disaster.”

In addition to Martin’s oral presentation, TopLine will also exhibit Solder Columns in booth #4014. TopLine recently announced the availability of new low-void solder columns, developed by TopLine engineers using new proprietary processes. The absence of voids in the column's high temperature core makes the columns structurally stronger and more reliable.

Space Tech Expo USA is considered to be the West Coast’s must-attend B2B exhibition and conference for space technology and services. Now in its 10th edition, Space Tech Expo USA returns to Long Beach, California, May 23 -25. For more information about the show, visit https://www.spacetechexpo.com/.

About TopLine

TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.

MEDINA, MINNESOTA ― May 2022 ― ASC International, a leading manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, is pleased to offer the LaserVision SP3D Mini 3D Solder Paste Inspection system. The system offers the same level of overall measurement capabilities as the VisionPro SP3D, but utilizes a lower cost microscope platform and the ability for customers to supply their own PC if needed. The SP3D Mini sets the affordable boundary on reliable, low-cost SPI solutions.

The LaserVision SP3D Mini provides a powerful alternative to visual inspection of solder paste deposits, automatically calculating and storing critical printing characteristics in one click. The system enables ASC International to offer the same remarkable SPI technology found in their VisionPro and VisionPro AP Series models, but in an entry-level instrument. This makes LaserVision SP3D Mini ideal for manufacturers striving for better process control of the paste printing process, but working with a limited budget.

The SP3D Mini’s optional laser scanning feature provides 3D profiling capabilities along with added accuracy and repeatability due to increased data acquisition. This feature also provides a second layer of analysis to establish proper corrective actions based upon qualitative defect attributes.

For more information about ASC International, visit www.ascinternational.com.

(South Plainfield, NJ USA) – May 3, 2022 - The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, May 17.

MacDermid Alpha has a portfolio of products proven to meet the most demanding electrical and thermo-mechanical reliability requirements of the automotive industry including solutions for safety, LED lighting, in-cabin electronics, underhood for powertrain related electronic systems, and electric vehicle - power electronics.

“When it comes to customer applications, not everyone has the same needs and requirements. For this reason, MacDermid Alpha has a broad line of solder pastes designed for resistance to both thermo-mechanical fatigue and electrochemical migration,” stated Scott Lewin, Regional Marketing Manager. “We are continually innovating with a portfolio of products proven to meet the most demanding requirements of the automotive industry.”

Alpha and Kester will feature their technologies engineered for enhanced reliability through ALPHA CVP-390V and Kester NP505-HR solder pastes with the industry leading high reliability Innolot alloy. Additionally, low temperature solder pastes including Alpha’s recently launched, ALPHA OM-565 solder paste with HRL3 alloy will be promoted as well as the ALPHA HiTech portfolio of adhesive, underfill, and edgebond solutions.

In addition, a representative from MacDermid Alpha’s Reclaim and Recycling program will be available to discuss options for processing various types of assembly materials. With over thirty years experience, MacDermid Alpha is North America’s largest solder manufacturer and recycler of electronics manufacturing waste. “We are committed to creating a more sustainable supply chain,” said Robert Wallace, Director of the Americas Reclaim Business. “We work closely with our customers to support their environmental initiatives for recycled products and managing their waste streams.”

For additional information about MacDermid Alpha’s industry-leading assembly products and services, please visit MacDermidAlpha.com.

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Electrolube, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.