Hayward, CA, January 4, 2022: Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and electronics industries, today announced the transition of Joe Montano from President to President and Chief Executive Officer. Effective January 1, 2022, Joe will be responsible for Delphon’s overall operations and for leading the company through its next phase of growth. Joe succeeds Jeanne Beacham, who recently announced her decision to transition from CEO to Executive Chair focusing on M&A opportunities and collaborations with new partners to expand Delphon’s capabilities and product offerings into new markets.
Highly regarded manufacturers’ representative enriches customer experience in Midwest region.
Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions and the Premier sponsor of IPC APEX Expo, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 25-27, 2022 in San Diego, California.
January 5, 2022 - Haverhill, MA USA - The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use various lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium.
Redmond, WA, January 5, 2021 – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced data and security deployment solutions for flash, flash-memory based intelligent devices and microcontrollers, announced that Dr. Cheemin Bo-Linn will be joining the Board of Directors of Data I/O. Dr. Cheemin Bo-Linn is the CEO of Peritus Partners, a valuation accelerator, for industry sectors including automotive, electronics, consumer, and medical sectors with integrated security.
SAN JOSE, CA ― January 2022 ― SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.