Entering the market in 2017, and now the world’s second-largest supplier of integrated coating and dispensing solutions for the electronics industry, Mycronic AB (publ) continues to expand its global offering at Productronica in Munich, November 16-19, 2021. In addition to a versatile new modular conformal coating, inspection and curing line, the company will also demonstrate the world’s fastest all-material jetting system, the latest industrial dispensing technologies as well as a range of advanced on- and off-line process control software solutions.

DOWNERS GROVE, ILLINOIS – November 10, 2021 – Hirose, an associate member of the Consortium for On-Board Optics (COBO), has helped create the Multi-Mode Waveguide Interconnect System (MWIS) Working Group to advance the increase of bandwidth and reduce power consumption for printed circuit board interconnect systems. The Consortium for On-Board Optics is a member-driven standards-setting organization developing specifications for interchangeable and interoperable optical modules that can be mounted onto printed circuit boards. Led by Joshua Kihong Kim, Principal Engineer at Hirose Electric, COBO's new MWIS Working Group focuses specifically on the replacement of copper traces with multi-mode waveguides and adding an extra thin interface for Electrical/Optical and Optical/Electrical conversion within close proximity to the electrical component.

With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is in the spotlight. With assembly of EFB at an OSAT, the development
highlights the ability of OSATs to have a strong play in the high-performance packaging market. TechSearch International discusses the advantages of fan-out on substrate and embedded bridge structures
with an emphasis on packaging for advanced nodes. The adoption of chiplets is expected to remain one of the most important advances in this decade. Advanced packaging options from foundries, IDMs, and OSATs are highlighted including developments in 3D. Challenges such as test and thermal issues are presented with some potential solutions. A market forecast for silicon interposer and high-density FO
packages is provided. Trends in high bandwidth memory (HBM) are discussed and a market forecast is included.

Expanding Saki’s business development activities for automated inspection and measurement systems in Germany