Circuits Assembly Online Magazine - Current

Press Releases

Cranston, RI USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the implementation of solar power at its Cranston, Rhode Island facility.

Enics is strengthening its procurement capabilities in the challenging component market situation, and to enable and drive the favorable long-term development in critical business area; Mr Denis Laxague is appointed Chief Procurement Officer as from 2nd August 2021 onwards.

August 5, 2021 (Indianapolis, IN) – Specialty Coating Systems, Inc. (SCS), a global leader in Parylene and liquid conformal coating services and technology, today announced that it will exhibit at MD&M West, scheduled to take place Aug. 10 - 12, 2021 at the Anaheim Convention Center in CA. The company will exhibit its conformal coatings in Booth #2038.

IPC today issued the following statement by its President and CEO, John Mitchell, on the bipartisan infrastructure bill approaching a vote this week in the U.S. Senate:

Minneapolis, Minnesota — August 4, 2021 — CyberOptics Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will feature the WX3000 metrology and inspection system with MRS sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the Virtual Connecting Heterogeneous Systems Summit Sept. 1-3, 2021.

Minneapolis, MN - The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is “Advanced Packaging: The Dawn of a New Era.” The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.