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[June 21, 2021 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join NEPCON Asia held at Shenzhen Exhibition & Convention Center from August 25 – 27, 2021. Visit booth #1H55 to experience the latest in Smart Factory Test and Inspection. 

Join TRI at NEPCON Asia 2021 to discover the AI Verify Host, TRI's newest AI solution. The AI Verify Host is an AI-powered Smart Repair Station that reduces manual re-inspection and lowers operational costs. The AI-powered repair station enhances the production process by lowering false calls and provides real-time data analytics of the inspection status.

TRI will showcase the recently released 3D SPI, TR7007Q Plus, equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images. Also exhibiting will be the AI-powered 3D AOI TR7700Q SII with an industry-leading speed of up to 57cm2/sec. TRI's lineup will also include the high-end 3D AXI TR7600F3D SII and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.

Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload.

About TRI

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.

Irvine, California, USA - Dr. Jeffrey Sokol has joined TopLine Corporation to provide guidance in matters involving aerospace and defense to C-level management, it is announced today. Dr. Sokol’s background as a Senior Engineering specialist in hybrid microcircuits, radiation effects, and system survivability contributes to TopLine’s growth plans.

Dr. Sokol received his Bachelor’s Degree in Engineering Science from SUNY at Stonybrook, his Master’s in Electrical Engineering from NYU, and his Ph.D. in Electrical Engineering from The Polytechnic Institute of NY. He has 37 years of combined experience in electronic parts engineering, radiation effects, system survivability, and electrophysiology. He has worked with the Defense Supply Center Columbus (DSCC), NASA, NOAA, as well as various commercial enterprises, most recently Aerospace Corporation.

“Jeff’s experience spans such a wide swath of our industry. We are excited that he is a member of our advisory team, and look forward to working with him,” stated Martin Hart, CEO of TopLine. “Jeff is a well-respected Ph.D. and a Subject Matter Expert in the world of defense and aerospace.”

About TopLine

TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, including Daisy Chain test packages for engineering development, profiling, and practice. TopLine products provide hands-on learning for engineers. For more information, visit www.TopLine.tv.

Austin, TX – June 2021 – Austin American Technology (AAT) is pleased to announce that it has successfully completed the installation of a Mega ION® SA at KYZEN’s Applications Lab in Nashville, TN.

The Mega ION SA is the perfect addition to KYZEN’s Applications Lab for cleaning test requiring a semi-aqueous process. The Mega ION SA rinses with de-ionized water rather than using a solvent to both wash and rise.

Ram Wissel, KYZEN’s Technology Manager stated, “KYZEN is excited to add the Mega ION® SA to our Nashville Applications Lab. This semi-aqueous wash provides an efficient alternative for devices that are sensitive to high-impact energy aqueous spray or ultrasonics. Today’s challenging flux residues are removed by matching them with the optimal solvent-based cleaning agent and a simple water rinse.”

KYZEN’s Applications Labs are equipped with the latest analytical equipment and staffed with a team of highly trained chemists to provide support to our customers worldwide. These resources are key to ensuring your process is and remains a robust process by profiling the wash bath and providing guidance for corrective action if necessary. KYZEN’s Applications Labs provide its customers with unparalleled laboratory services to see them through a wide range of problems.

The Mega ION cleaning system is designed for high reliability applications requiring product cleanliness verification (IPC ROSE Testing). It is used for final clean prior to conformal coat, encapsulation or other sealing operations used to protect electronic modules.

Science and Care truly Converge in KYZEN’s Applications Laboratories located around the world. For more information about KYZEN, visit www.kyzen.com.

For more information about Austin American Technology, please visit www.aat-corp.com.

About Austin American Technology:

Austin American Technology is on the forefront of engineering and manufacturing high performance cleaning system for over 35 years, delivering solutions worldwide. AAT was founded in 1986, as a provider of SMT rework systems and process engineering testing services. In 1988, their focus shifted toward the high-end electronics cleaning segment with the introduction of the world’s first automated stencil cleaner. In 2000, Austin American Technology became a market leader in inline cleaning systems with the introduction of the award-winning HydroJet® series. Patented cleaning and drying technologies were incorporated into an energy and space-efficient format to set new standards for performance and low cost of ownership. Building on this success, AAT introduced the MicroJet® inline flip chip cleaner to provide high volume cleaning capability in a small footprint. In 2013 AAT introduced the world’s smallest most efficient inline cleaner, the NanoJet®.

MADISON, AL – June 2021 - STI Electronics, Inc., a full service organization including engineering, contract manufacturing and training services announces it has successfully completed certification for QML IPC-1791.

Under IPC's Validation Services Program, STI Electronics, Inc. has earned an IPC-1791 Qualified Manufacturers Listing (QML) certification. The company continues to be a trusted source and supplier, meeting the stringent requirements for the electronics industry’s newest most comprehensive system for supply chain security. STI is listed and recognized as an IPC trusted source capable of delivering secure systems in accordance with industry best practices.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.

¬About STI Electronics, Inc. Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and contract PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. For more information, visit www.stiusa.com.

HORSHAM, Pa.--(BUSINESS WIRE)--Aegis Software, a global provider of Manufacturing Operations Software (MOM/MES), announces that Europlacer has expanded its 20+ year reseller relationship, for Aegis’ FactoryLogix® Digital Manufacturing Engineering software module, to now include China. Additionally, Europlacer is the first placement systems provider to achieve IPC Connected Factory Exchange (CFX) qualification, thereby enabling “plug & play” IIoT connectivity with Aegis’ FactoryLogix Platform, as well as any CFX-qualified factory information systems. With Europlacer and Aegis Software, manufacturers can effortlessly leverage IIoT data to monitor, control, and improve factory automation without requiring IIoT middleware or custom coding.

Europlacer Expands Existing Reseller Relationship with Aegis Software. Reseller Agreement Expands to China, and Europlacer Achieves IPC CFX Qualification for Plug & Play IIoT Connectivity with Aegis’ FactoryLogix Platform

“Now more than ever, manufacturers are seeking ways to become more agile and resilient. Foundational to achieving that desired agility and resiliency is a factory that can support seamless connectivity of machines, systems, and devices to provide the necessary levels of control, visibility, and efficiency without complexity, endless customization, or high costs. Europlacer and Aegis share a common goal of enabling factories of any size worldwide to achieve Industry 4.0 benefits. We are very proud of the long-standing synergistic and collaborative relationship that we have with Europlacer and look forward to continued success,” stated Jason Spera, CEO, and Co-Founder, Aegis Software.

About Europlacer

Founded 50 years ago, the Europlacer Group (formerly known as Blakell Europlacer) is active and pre-eminent in the electronic circuit board assembly sector with advanced product and service solutions for electronics manufacturers in the USA, UK, France, China and globally. Europlacer manufactures component placement as well as screen printing equipment used worldwide in surface mount assembly processes. The company also delivers full line solutions incorporating a range of associated equipment, including AOI, reflow and PCB handling.

Visit www.europlacer.com to learn more.

June 22, 2021 - Haverhill, MA, USA - Circuit Technology Center announces that it has issued a purchase order to RPS/Hentec for two additional Odyssey 1325 robotic hot solder dip (RHSD) machines. The Odyssey 1325 is a MIL spec complaint, high-volume, high-mix component lead tinning machine equipped with auto load/unload and is capable of processing dual solder alloys. The equipment complies with all applicable GEIA-STD-006, J-STD-001 and IEC TS 62647-4 standards.

This purchase will double the existing capacity of Circuit Technology Center's component level modification services department to meet the increasing demand from the defense and high reliability customer base that require component level modification/alteration for tin whisker mitigation, gold mitigation and lead re-conditioning applications. This state-of-the art equipment is also used for automated, touch-less BGA component de-balling, required as part of converting BGA’s with lead free solder to tin-lead solder.

"For nearly 40 years, leading defense and aerospace companies have relied on Circuit Technology Center as the world leader in circuit board level modification and damage repair services," said Andy Price, Sales Manager at Circuit Technology Center. “We are thrilled to announce this capacity expansion, offering our defense and high reliability customers component level modification and alteration services with the same level of exceptional quality and service that they have come to expect from our company.”

Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world.

For more information, please visit: www.circuitrework.com. Phone: 978-374-5000, Fax: 978-372-5700, Web: www.circuitrework.com.

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