In today's world of electronics, semiconductor components are essential. For the manufacturing of these components the cleaning of metal surfaces before wire bonding or injection molding of the semiconductor housing is still an important and necessary step. Contaminated and oxidized metal surfaces can cause low wire bond strength and lead to failures due to interruption of the electrical contacts. At productronica 2019 Plasmatreat GmbH will be presenting its Openair-Plasma technology for cleaning surfaces live to the audience of experts.

With regards to PCB soldering, electronic manufacturers often have the choice between reflow soldering and vapor phase soldering. Taking the significant increase in energy costs in the future into consideration, Asscon is focusing on the significant energy saving potential of its inline vacuum Vapor-Phase Soldering Systems at productronica 2019.

At Dynamic EMS, our door is always open to try to solve our customers’ challenges.  In this instance, a prospect came to us with a problem that they were experiencing.  We thought you’d like to read the advice we gave based on a true life example.

07 November 2019 – Seoul, South Korea – Over the past years Koh Young Technology’s drive to not only satisfy but to exceed our customers’ expectations lead to further innovations and a wider range of product portfolio.