Atlanta, GA – Once again, Koh Young Technology, the industry leader in True3D measurement-based inspection solutions, was recognized by the Financial Times as a FT500 High-Growth Company (Asia-Pacific). Established in 2002, Koh Young Technology pioneered a new market by launching the world’s first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technique. Since then, we have become a global leader with our 3D measurement-based inspection equipment, as well as a solutions provider that performs a key role in quality management and process optimization for various industries. Based on this differentiated technological competitiveness, we have secured thousands of customers, while maintaining the largest global market share in the 3D SPI and 3D AOI markets.

GARLAND, TX ― September 2020 ― National Circuit Assembly, a provider of PCB, cable and electro/mechanical manufacturing and test services to leading OEMs, is pleased to announce that it has purchased a Test Research, Inc. (TRI) TR7500 SIII 3D AOI system to add to its established range of AOI machines. TRI’s optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible.

Crystal Brownell has joined Z-AXIS as a sales specialist at the electronics design and contract manufacturing center near Rochester, NY.

Adds automated production and test equipment to increase capacity, quality and throughput at electronics manufacturing center near Rochester, NY