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SAN DIEGO, CA – Intraratio is pleased to welcome Ken Reilich as its new Senior Vice President of Worldwide Sales and Marketing. In his new role, Ken will be instrumental in leading global sales and marketing initiatives driving Intraratio’s revenue growth and significantly enhancing Intraratio's market position.

"Ken’s appointment is a significant milestone for Intraratio,” said Ryan Gamble, CEO and Founder of Intraratio. “His extensive expertise in global sales and business development aligns perfectly with our growth objectives. We believe his leadership will propel Intraratio to new heights in the market."

Ken brings an impressive 15-year tenure as an executive sales and business development leader with a proven track record of providing excellent organizational and operational performance. His background in engineering management across the entire semiconductor ecosystem, combined with his extensive experience in negotiating and collaborating with C-suite executives aligns seamlessly with Intraratio's vision and objectives.

Ken’s recent roles include, serving as a Vice President Sales at Synapse Design Automation, Inc., having joined to lead tier Tier 1 accounts and new logo account acquisition, expanding the company's customer base. Previously, Ken served ten years at TessolveDTS, Inc., serving as their Vice President of Business Development, where his leadership contributed to a 6X growth of the company’s revenue and facilitated a 500% company headcount increase. Ken’s Executive roles include serving as the Executive Director of Sales at Rapid Bridge, LLC, where he consistently exceeded 120% of the company's annual revenue targets.

“I’m thrilled to join the Intraratio team as a key leader driving the company’s vision for true implementation of Smart Manufacturing by changing the Semiconductor/Photonics, and SMT industries paradigm and driving Industry 4.0 initiatives,” said Ken. “Intraratio’s incorporation of AI/ML into the manufacturing ecosystem will facilitate vast improvement in operational efficiencies that are a critical requirement to meet the unmet engineering demand for the foreseeable future.”

For more information about Intraratio, please visit www.Intraratio.com 

AUBURN HILLS, MI – The Murray Percival Company, one of the longest tenured distributors in the electronics industry, is excited to announce its participation in the upcoming SMTA Dallas and Houston Expos & Tech Forums. This marks a significant milestone in Murray Percival's strategic expansion across the United States, reinforcing its commitment to bringing unparalleled supply solutions and legendary service to the PCB industry on a national scale.

Murray Percival III, Sales Manager at Murray Percival Company, shared his enthusiasm for the upcoming expos: “Texas represents a vibrant and dynamic market for the electronics industry, and we are thrilled to be a part of it. By participating in the SMTA Dallas and Houston events, we are not just showcasing our cutting-edge solutions, but we are demonstrating our commitment to supporting the growth and success of our clients nationwide through the ‘Percivalized’ experience. This is an exciting chapter in our company’s story, and we look forward to connecting with old friends and making new ones in the Lone Star State.”

Event Details:

SMTA Dallas Expo & Tech Forum 2024
Date: Tuesday, March 19, 2024, at 8 a.m. CT
Location: Plano Event Center

Houston Expo & Tech Forum
Date: Thursday, March 21, 2024, at 8 a.m. CT
Location: Stafford Centre

These expos provide a unique platform for industry professionals to converge, share insights, and explore global technologies at a local level. Attendees, including Process Engineers, Manufacturing Engineers, Production Managers, and more, will gain invaluable exposure to the latest trends and innovations in the PCB industry.

Murray Percival, a family-owned business now in its third generation, has been serving the PCB industry for more than 60 years. Their comprehensive offering of assembly equipment and production supplies positions them as a leading supplier to the electronics industry in the Midwest. The company provides legendary service, improving processes, maximizing ROIs, and exceeding customer expectations. For further inquiries or to explore how The Murray Percival Company can address your PCB supply needs, please visit www.murraypercival.com 

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Productronica China international trade fair taking place March 20-22 at the Shanghai New International Expo Centre (SNIEC) in Shanghai, China. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at Productronica China March 20-22 at booth #4716, or visit www.aimsolder.com 

NEW BRITAIN, CT – MicroCare™ LLC, a globally recognized manufacturer specializing in high-performance fluids and tools for critical cleaning, coating, and lubricating applications, is pleased to announce its participation in the upcoming IPC Apex Expo 2024. The event will take place from April 9-11 in Anaheim, CA, and MicroCare will be proudly presenting its latest advancements at booth 1812.

MicroCare will display its extensive product range, featuring cleaning fluids tailored to address the evolving PCB cleaning needs of the electronics industry. A highlight of the showcase will be the MicroCare line of 3M Novec™ replacement flux removers, contact cleaners and electronics degreasers. These tested, tried, and trusted fluids serve as excellent alternatives and are readily available for immediate global shipment. This includes the MicroCare Tergo™ line of vapor degreasing fluids. Their high densities and low surface tensions allow them to effectively clean and remove a variety of PCB contaminants.

As the phase-out of 3M Novec™ Specialty Fluids looms by 2025, MicroCare emphasizes the importance of transitioning to alternatives now. Ray Bellavance, MicroCare Vice President of Global Sales and Marketing, stated, "Don’t wait for a global shortage. Start planning your changeover now with MicroCare. With years of experience supplying precision cleaning solutions, we are here to assist customers with fluid choices, equipment upgrades and process improvements.”

One highlighted product includes the MicroCare Universal Flux Remover which boasts a host of features that make it stand out in the market. As a safe, nonflammable HFO-based flux residue and solder paste remover, it offers superior performance while minimizing environmental impact. Both the cleaning fluid and the propellant are HFO (hydrofluoroolefin) azeotropes, promoting ozone safety and an ultra-low Global Warming Potential (GWP).

In addition to electronics cleaning fluids, MicroCare will also feature the TriggerGrip™ PCB cleaning tool with its newly designed adapter, streamlining the installation process and providing more secure connectivity to the MicroCare flux remover aerosol cans. The TriggerGrip cleaning system targets dirty areas and eliminates overspray to reduce solvent use by 66%.

Also featured at the event will be the Sticklers™ PRO360°™ Touchless Cleaner, specifically designed to address the growing prevalence of fiber optic components on modern PCBs. Given the delicate nature of fiber optic connectors, specialized tools are essential for their cleaning, distinct from those used for traditional PCB cleaning. The PRO360°™ swiftly and effectively cleans fiber optic connections without leaving residue, static, or causing damage. It provides over 2,000 contactless, full end face cleanings in each replaceable cleaning canister.

"IPC Apex Expo provides the perfect platform for us to engage directly with industry professionals and demonstrate how our latest products can elevate their cleaning processes," added Bellavance.

Attendees are invited to visit MicroCare at booth 1812 during IPC Apex Expo 2024 to explore the full range of innovative cleaning solutions and interact with the company's knowledgeable team.

For more information about MicroCare, LLC and its innovative cleaning solutions, visit microcare.com.

CLINTON, NY – Indium Corporation® is set to showcase its advanced metal thermal interface materials (TIMs) for burn-in and test at TestConX 2024, March 3-6 in Mesa, Ariz., U.S.

As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase selections from its array of high-performance metal TIM solutions.

Renowned for their superior thermal conductivity compared to non-metals, Indium Corporation’s indium-containing TIMs for burn-in and test stand out, with pure indium metal delivering 86W/mK. These TIMs are available in various forms, including pure indium, indium-silver alloys, and indium-tin. The pure indium TIM can be optionally clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent indium from adhering to the surface. Indium Corporation’s suite of standard Heat-Spring® solutions, which feature a compressible interface between a heat source and a heat-sink, include:

Heat-Spring® HSD

  • The original and best standard option for interfaces with flat, smooth and parallel surfaces.
  • Designed for interfaces with tight surface control >30psi

Heat-Spring® High Profile Preforms

  • Patterned to optimize contact with non-planar surfaces delivering 86W/mK
  • Ideal for assemblies with an extruded, unfished heatsink
  • Recommended for immersion cooling and Burn-In applications
  • Provides uniform contact between the burn-in head and the DUT
  • Provides more uniform thermal conductivity
  • Recyclable and reclaimable

Heat-Spring® HSK

  • Recommended specifically for burn-in applications where multiple insertions are required
  • Provides uniform contact with low resistance for high-density heat loads
  • Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
  • No staining or cracking

To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX or online at indium.com/TIM

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces Senior Application Engineer Ravi Parthasarathy will be presenting defluxing strategies for high-density advanced packaging with ultra-fine pitch die on Chip-on-Wafer (CoW) technology during his presentation at the upcoming iMAPS Device Packaging Conference (DPC) on Thursday, March 21, from 10:30 AM to 11:30 AM.

With his extensive experience and expertise in the field, Sr. Applications Engineer, Ravi Parthasarathy will delve into the challenges and solutions related to defluxing strategies for high-density advanced packaging. The presentation will focus on the unique demands of ultra-fine pitch die on CoWs, providing valuable insights and practical approaches to enhance cleaning processes.

ZESTRON is at the forefront of developing cutting-edge solutions for precision cleaning and Ravi’s presentation aligns perfectly with the company's commitment to advancing industry knowledge and addressing emerging challenges.

ZESTRON invites all DPC attendees to join Ravi Parthasarathy's presentation on Thursday, March 21, from 10:30 AM to 11:30 AM, and visit the ZESTRON booth to learn more about their state-of-the-art precision cleaning solutions.

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