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Press Releases

Celestica, Inc., Creganna, Flextronics International Ltd., Heraeus Holding

According to a new report published by Allied Market Research, titled, "Medical Device Outsourcing Market by Product (Raw Materials, Electronics, and Finished Goods), by Device Type (Class I, II, and III Devices), by Application (Orthopedic & Spine, Cardiovascular, Radiology, and General Medical Devices), and Service (Prototype Development, Finished Device Manufacturing, Assembly & Packaging; and Testing & Regulatory Support Services) - Global Opportunity Analysis and Industry Forecast, 2020-2027" The report has offered an all-inclusive analysis of the global Medical Device Outsourcing Market taking into consideration all the crucial aspects like growth factors, constraints, market developments, top investment pockets, future prospects, and trends. At the start, the report lays emphasis on the key trends and opportunities that may emerge in the near future and positively impact the overall industry growth.

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NOTE has a strong and diversified customer base with both established industrial companies and companies in new fast-growing application areas.

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MANCHESTER, NH. (June 16, 2020):  EPE Corporation, an industry expert in high-reliability Electronics Manufacturing Services (EMS) since 1965, has recently invested in its Surface Mount Assembly line capacity with the purchase of two new Mycronic MY300DX-17 pick-and-place machines, feeder systems and other line software upgrades.

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SAN JOSE, Calif.--(BUSINESS WIRE)--Jun 17, 2020-- The HiWire Consortium, a non-profit corporation supporting the advancement and adoption of HiWire Active Electrical Cables (AECs), announced today that Celestica has joined the HiWire Consortium.

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Brooklyn, NY, June 17, 2020 (GLOBE NEWSWIRE) -- Brooklyn, NY, June 17, 2020 (GLOBE NEWSWIRE) – Cemtrex Inc. (Nasdaq: CETX, CETXP, CETXW), a leading multi-industry technology company that is driving innovation in a wide range of commercial sectors such as Internet of Things (IoT), Augmented and Virtual Reality (AR & VR), and Artificial Intelligence and Computer Vision (AI & CV), today announced that it has received a written notice from NASDAQ stating that the Company has regained compliance with NASDAQ listing requirements.

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•    The latest products for semiconductor packaging will be demonstrated in Booth E3451

Aylesbury, Bucks, UK – 17 June 2020 -- Nordson Corporation (NASDAQ: NDSN) announces that six product lines from its Nordson ELECTRONICS SOLUTIONS division will be exhibiting together at SEMICON China, the world's most well-known semiconductor industry exchange and trading platform, to be held June 27-29, 2020 at the Shanghai New International Expo Center and Shanghai Kerry Hotel Pudong, in booth E3451.

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