Circuits Assembly Online Magazine - Current

Press Releases

[August 19, 2019 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce that it will be featuring the Test and Inspection solutions for Semiconductor Packaging Production Lines at SEMICON Taiwan 2019. Visit TRI at booth # J3042 to discover High-Precision Inspection for the Semiconductor Industry at Taipei Nangang Exhibition Center Hall 1.

Chino, CA — August 2019 — Scienscope International, a leading American supplier of cabinet style micro-focus X-ray systems, announced today the appointment of Adrian Radu to the European Sales Manager position, effective immediately.

BPM Microsystems is the leading global provider of device programming systems for test and measurement systems, factory integration software, and solutions for the semiconductor and electronics industries.

NASHVILLE — August 2019 — KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that T.C. Loy, KYZEN Sdn Bhd’s Technical Sales Manager, will present at the 2019 IPC Southeast Asia High Reliability Conference – Thailand, scheduled to take place Aug. 16, 2019 at The Grand Fourwings Convention Hotel. Loy will present: “Developing Cleaning Process Parameters.”

OSAKA, JAPAN — August 2019 — Nihon Superior Co. Ltd., an advanced joining material supplier, today announced plans to exhibit in Booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.

EAST HANOVER, NJ – At the SMTA International 2019 technical conference, Portland State University and Zymet will present their investigations on enhancing the board level reliability of large WLP’s, for harsh environment applications. WLP’s, which include WLCSP’s and FO-WLP’s, offer a path to lower weight, smaller formfactor, and higher performance. However, their low coefficient of thermal expansions are not well matched to that of commonly used organic substrates.