ARLINGTON, WA ― December 2019 ― CheckSum, a leading provider of test systems, fixtures and programs, is pleased to announce that Nortech implemented its existing software environment for an end of line test (overmolding) with CheckSum’s user-friendly interface. Nortech already had a CheckSum in-circuit test fixture and program, and could send serial commands to control the functionality of the board since the software allows running external .exes. Nortech also had the ability to perform any software updates to the test units before the overmolding application.
Hamburg/Nuremberg, Germany, December 2019 - optical control, now part of Nordson DAGE, has received the Deloitte Technology Fast 50 Award. optical control was recognized for its significant sales growth over the last four fiscal years [2015-2018]. Optical control has been on the market since 2013 with an X-ray scanner and the corresponding intelligent software technology, which makes it possible to count electronic components contact-free and fully automatically. The optical control technology, developed in-house, made a significant contribution to this sales growth.
LYON, France - December 2, 2019 | “Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole).
Select team brings software support closer to customer base, provides time-sensitive coverage.
BANNOCKBURN, Ill., USA, December 2, 2019 — IPC – Association Connecting Electronics Industries announces a leadership change within the IPC Education Foundation (IPCEF). At the end of the year, Colette Buscemi, senior director, IPCEF, will leave the Foundation and Charlene Gunter du Plessis, who currently serves as the Foundation’s director of strategic partnerships and programs, will transition into the role of senior director.
One of the greatest challenges in programming AOI, (Automatic Optical Inspection) systems is the detection of all non-conforming placements, especially those related to solder joints, without creating a long list of ‘’False Calls’’. The industry has always faced this problem and has had to accept that the more accurately you wish to measure, the more false judgements a system will make. It commonly results in long debugging time and complex programming.