Fontana, California, May 2018: Everett Charles Technologies’ (ECT’s) LFRE plated probes successfully passed extensive qualification testing verses an incumbent probe at a major US based OEM for power infrastructure equipment.
Seoul, South Korea – Koh Young Technology will exhibit “True 3D Smart Factory solutions powered by the AI platform” in booth 4C-20 at the upcoming JPCA show scheduled for June 6-8, 2018 at the Tokyo Big Sight in Japan.
Leading distributor of capital equipment for the electronics assembly industry in the UK and Ireland, Altus, is further strengthening its team in the UK with the announcement of a new spare parts and logistics co-ordinator to support the company in an operational capacity.
MENTOR, OH ― May 2018 ― Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that it has installed an Omron VT-S730 3D Post Reflow AOI system at its Mentor facility. The company now has three 3D AOI systems from Omron, with the first two already running at its Dallas, TX facility.
NEW YORK, May 25, 2018 (GLOBE NEWSWIRE) -- According to the new market research report published by P&S Market Research, global anti-counterfeit packaging market is projected to reach $208.4 billion by 2023, growth of the counterfeit industry and increasing focus of manufacturers on brand protection are the major factors driving the market growth.
Xcerra combines innovative contacting technology with reliable test handling solution
St. Paul, MN (USA), May 2018: Multitest recently delivered a production interface solution to a customer for OTA testing of a 60 GHz UltraGig single-chip integrated Antenna in Package (AiP). The solution integrates the xWave OTA Contactor with xWave patch antenna in the MT2168XT leadbacker.