Irvine California, USA – TopLine will exhibit its innovative CCGA technology and other packaging solutions for at the upcoming Aerospace Technology & Components Expo (AeroTech), February 6 through 8, 2019 at Tokyo Big Sight in Japan. TopLine will exhibit its CCGA technology in Booth 38-32.

Lakeville, Minnesota, January 15, 2019 – ITW EAE, the Electronic Assembly Equipment division of ITW will be showcasing MPM, Camalot, Electrovert and Vitronics Soltec equipment at the IPC APEX Expo, January 29 - 31, 2019 in San Diego, California. The ITW EAE booth (3339) will have Engineers and Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.

Challenges in handling highly filled and abrasive materials

When it comes to electrically conductive materials, we are dealing with dispersions. They are generally referred to as electrically conductive adhesives, silicones or inks.

Seoul, South Korea – As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology will show how its true 3D solutions can improve production throughput and yield at the IPC APEX Expo during 29-31 January 2019 in San Diego, California. This year, Koh Young will display an array of new inspection systems with expanded capabilities at Booth 1908 in the San Diego Convention Center.