July 12, 2018 ― Cranston, Rhode Island USA ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its commitment and partnership with Alfatec and the Brazilian market. David Suraski, Executive Vice President, and Franics Lapierre, Vice President, Operations & Administration, visited Brazil last week to affirm that this is an important market to AIM Solder and the company looks forward to nuturing its existing relationships, and building new ones in the future.
Envoy provides customers throughout Brazil with equipment and materials selection services, process expertise and technical support
Rehm Thermal Systems will present innovative concepts for the digital factory at its Technology Days on 10 and 11 October 2018 in Blaubeuren. Rehm will take the guests on an exciting journey to the “Islands of Technology”, which will be the central theme of this year’s programme. The most interesting hot spots in electronics production and the world of surface mount technology will be addressed. Rehm will also provide information on where the path in assembly production is heading and show the way through the digitisation jungle.
[August 8, 2018 – Taipei, Taiwan] Test Research, Inc.'s (TRI) latest Optical Inspection and Electrical Testing solutions will be displayed at Productronica India Trade Fair. Visit TRI's Booth #PB55 in Hall 3 with the cooperation of TRI's distributor, Test & Research India PVT. LTD., at BIEC, Bengaluru, India, from September 26th to 28th, 2018.
Manassas, VA – August 7, 2018 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, will be featuring its leading cleaning technologies HYDRON®, MPC®, and FAST® at the SMTA Austin Expo and Tech Forum.
Minneapolis, Minnesota — August 7, 2018 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will demonstrate the MRS-Enabled SQ3000 with multi-process capabilities including 3D AOI, SPI and CMM applications at NEPCON South China at the Shenzhen Convention Center, August 28-29th in booth #1J45.