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Press Releases

NAPLES, FL ― November 2018 — MW Associates, a global all-electronics marketing and electronics assembly consultancy agency, announces that its President Megan Wendling received the Councilor of the Year Award from SMTA China for the seventh year.

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TORONTO, Nov. 14, 2018 (GLOBE NEWSWIRE) -- Celestica Inc. (NYSE, TSX: CLS), a leader in design, manufacturing and supply chain solutions for the world’s most innovative companies, today announced that it has utilized the accordion feature under its current credit facility to add an incremental  $250.0 million term loan (the “Incremental Term Loan”), for total term loan borrowings under such facility of $600.0 million. Net proceeds of the Incremental Term Loan were used to repay approximately $245.0 million of the $339.5 million borrowed under the Company’s revolving loan to finance its recently-announced acquisition of Impakt Holdings, LLC. The Incremental Term Loan bears interests at LIBOR plus 2.5%, and in connection therewith, the interest rate on the Company’s original $350.0 million term loan increased to LIBOR plus 2.125%. The Incremental Term Loan is subject to quarterly principal repayments of $625,000, and matures together with the original term loan in June 2025. The Incremental Term Loan was provided by a syndicate of lenders and Bank of America, N.A. as Administrative Agent. All dollar amounts are denominated in US dollars.

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New Equipment with Increased Capability and Capacity:

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Seoul, South Korea – Koh Young Technology, the industry’s leading 3D measurement and inspection company, announced a record-breaking third quarter with 25.5 percent year-over-year (YoY) growth during 2018. A focus on helping customers realize the value behind a Smart Factory underpinned Koh Young’s leadership position as the preferred inspection partner with more than 2,200 customers.

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Hanover, Germany, November 2018 – electronica, hall A3, stand 642 –  For in-line X-ray inspection (3D AXI), Viscom AG has developed the extremely fast printed circuit board transport system xFastFlow. This innovative solution is used in Viscom's X7056-II inspection system, which has won multiple awards and which can be seen at the electronica trade show in Munich from November 13-16.

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Hanover, Germany, November 2018 – At electronica 2018 in Munich, Viscom AG is presenting its successful S3088 ultra gold system in the field of 3D automatic optical solder joint inspection. The intelligently networkable inline inspection system provides clear, accurate and realistic inspection information, thus enabling optimal quality assurance for electronic assemblies.

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