BROMONT, CANADA, December 6, 2018 — Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, has appointed Davina McDonnell as its new Product Marketing Manager. Davina will be responsible for the elaboration and execution of the global go-to-market strategy for Cogiscan products.
HAUPPAUGE, N.Y., Dec. 06, 2018 (GLOBE NEWSWIRE) -- Orbit International Corp. (OTC PINK:ORBT), an electronics manufacturer and software solution provider, today announced that consolidated bookings for its Electronics Group (“OEG”) and Power Group (‘OPG) exceeded $2,000,000 for the month of November 2018.
Our Italian colleagues and Latin scholars will know that the letter ‘D’ is the Roman numeral for 500. Right now, on the Europlacer manufacturing floor in Rocheserviere in France, the production team is preparing to build our 500th iineo placement machine.
SAN JOSE, CA ― December 2018 ― SHENMAO America, Inc. is pleased to announce the appointment of MIDwest TEKnologies as its representative in the Midwest region. The manufacturers’ representative will provide sales and customer support for SHENMAO in MN, ND, SD and IA.
December 4th, 2018 ― Cd. Juarez, Chih., Mexico ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, was pleased to provide training to Aptiv employees on October 22nd, 2018 at Aptiv Rio Bravo I in Ciudad Juarez.
This not-to-be-missed event on January 28, 2019 at IPC APEX EXPO 2019 is designed for executives in the global electronics systems supply chain. The forum features such worldwide notables as Dr. Udo Welzel, Team Leader of Automotive Electronics, Engineering Assembly and Interconnect Technology at Robert Bosch GmbH, who will present "Enabling Connected, Electrified and Automated Mobility: Challenges for Assembly and Interconnect Technology'. Also featured is Alex Stepinski Vice President of GreenSource Fabrication LLC and Managing Director of AWP GmbH, who will discuss the world's first “green” 4.0 PCB fabrication facility with single piece flow in-line automated facility with 100% layer traceability for advanced HDI/IC substrate/FPC production, plus its implications for automotive electronics.