Press Releases
EAST HANOVER, NJ – At the IPC’s APEX EXPO, Zymet will be featuring a reworkable edgebond adhesive that has recently been shown to be capable of significantly enhancing the board level reliability (BLR) of low temperature solder (LTS) assemblie.
Heraeus Electronics has opened a new Innovation Center in Shanghai to develop and test material systems.
Irvine California, USA – TopLine will exhibit its unique CCGA Column Grid Array technology in the USA Pavilion at the Electronica trade fair and conference in Munich, Germany, Nov 13-16, 2018.
ARLINGTON, Va.--(BUSINESS WIRE)--Oct 29, 2018--Cobham Advanced Electronic Solutions (CAES), a leading defense and aerospace electronics manufacturer, announced today that Shawn Black will join CAES as Chief Operating Officer.
Circuitsify, a full-service electronics contract manufacturing, expands their reach, from Los Angeles, California to “Hardware Silicon Valley” Shenzhen, China.
October 26, 2018 (Indianapolis, IN) – Specialty Coating Systems (SCS) is pleased to announce that it will participate in a Tech Briefs webinar on Wednesday, Nov. 28, 2018 at 2 p.m. EST.
Press Releases
- Parmi Expands Mid-Atlantic Sales Coverage with Cope Assembly Products
- Seika Machinery to Host SMI 2026 Webinar Series Session 2 on PCB Slicing Methods and Low-Stress Separation
- Pillarhouse USA Expands BarTron, Inc. Sales Territory into Indiana
- Mycronic appoints Peter Andries as General Manager of MRSI Systems and VP of Global Technologies Division