Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has experienced a few bumps on the road to higher volumes this year. Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF transceivers at the end of last year, and board-level reliability concerns from some customers, coupled with the option of lower-priced flip chip CSP substrates, prompted Qualcomm to lower its FO-WLP forecast this year and next. While Qualcomm’s forecast may be lower, others are stepping in to use recently installed capacity. FO-WLP has been adoption for some radar modules in vehicles equipped with advanced driver assist systems (ADAS) by companies including Infineon and NXP. Adoption of fan-out on substrate for high-performance applications is expanding.

Schaumburg, IL.  Bowman, a global manufacturer of XRF coating measurement instruments, held its 2017 International Sales Meeting in Chicago October 30 and 31, 2017.

BROMONT, CANADA, November 2017 — Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, today announced that it has partnered with MIRTEC to offer a fully integrated Industry 4.0 solution for its suite of vision inspection machines and software.

MENTOR, OH ― November 2017 ― Libra Industries, a privately held electronics manufacturing services (EMS) provider, today announced that it has received and completed the installation of a second Omron VT-S730 3D Post Reflow AOI system at its Dallas, TX facility. With the new 3D-SJI combo technology, Libra Industries can easily detect lifted lead, lifted component and component coplanarity, and provide high-quality solder joint inspection.