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Press Releases

Irvine, California, USA – TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.

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Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material.

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March 12th, 2018 ― Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announces their participation at the SMTA West Penn Expo & Tech Forum, scheduled to take place March 28th, 2018 at the DoubleTree Monroeville Hotel in Monroeville, PA.

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Somerset, NJ – March 12th, 2018 – Alpha Assembly Solutions, the world leader in the production of electronic soldering materials and bonding materials, will be introducing its new low temperature solder paste at Productronica China in Shanghai from March 14 - 16th, 2018.

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MADISON, AL — March 2018 — STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and small- to medium-volume contract PCB assembly, announces its domain change to www.stiusa.com.

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Kennesaw, Georgia, USA – The sharp, custom performance motorcycle in the center of the booth led the theme for YAMAHA’s IPC/APEX EXPO 2018 exhibit, “Revs Your Heart”, and there was much to quicken the pulse at the booth this year, judging from the many attendees swarming around the performance assembly technology arrayed around the perimeter of the exhibit.

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