Circuits Assembly Online Magazine - Current

Press Releases

MENTOR, OH ― November 2017 ― Libra Industries, a privately held electronics manufacturing services (EMS) provider, has purchased and installed Viscom’s new X8011-II PCB X-ray inspection system at its Dallas, TX facility.

Packing densities increase on ever smaller electronic assemblies due to technical requirements and possibilities.

NORTH BILLERICA, Mass., November 21, 2017 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Wednesday, Nov. 29, 2017 at Bestronics, Inc. in San Jose, CA.

Somerset, NJ – November 3rd, 2017 - Alpha Assembly Solutions, the largest solder manufacturer and recycler in North America, will host the SMTA Western Pennsylvania Chapter Meeting on Thursday, November 9 at Alpha’s Altoona, Pennsylvania manufacturing location.

November 22nd, 2017 ― Cranston, Rhode Island USA - AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place on November 29th, 2017 at Bestronics in San Jose, CA.

Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has experienced a few bumps on the road to higher volumes this year. Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF transceivers at the end of last year, and board-level reliability concerns from some customers, coupled with the option of lower-priced flip chip CSP substrates, prompted Qualcomm to lower its FO-WLP forecast this year and next. While Qualcomm’s forecast may be lower, others are stepping in to use recently installed capacity. FO-WLP has been adoption for some radar modules in vehicles equipped with advanced driver assist systems (ADAS) by companies including Infineon and NXP. Adoption of fan-out on substrate for high-performance applications is expanding.