Technical paper provides new insight into low cycle fatigue life of solder joints in electronic packages with encapsulations
 
Beltsville, MD – February 7, 2017 – DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that its technical paper, "Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints," will receive an Honorable Mention at the 2017 IPC APEX EXPO. Authored by DfR Solutions’ reliability experts Dr. Craig Hillman, Maxim Serebreni, Dr. Nathan Blattau, and Dr. Gilad Sharon, the paper explores the effect of polymer encapsulations on solder joints as it relates to reliability.

[February 6, 2017 – Taipei, Taiwan] Test Research, Inc. (TRI) will feature its new generation of SPI, AOI, AXI and ICT inspection solutions at a series of technology seminars held in Shenzhen, Suzhou and Taiwan. Each of the one-day events will focus on latest technology innovations in TRI's comprehensive PCBA test and inspection portfolio, including the YMS 4.0 solution for Industry 4.0 smart manufacturing.

As with many thermal processes, soldering fumes, aerosols and solid particles (residues) that must be removed from the process cycle are also produced when soldering electronic assemblies.

Horsham, PA., February 2017 -- Aegis Software announced today that Lockheed Martin Space Systems will implement Aegis’ FactoryLogix Manufacturing Execution Software (MES) at their Littleton, Colorado facility.